Notice of Participation in the 10th Adhesive and Joining EXPO from September 30 (Wednesday) to October 2 (Friday), 2026

Through diffusion bonding, complex shapes with internal flow paths can be realized! We are currently offering a collection of bonding case studies featuring materials such as quartz glass and pure molybdenum!

Diffusion bonding is a technology that directly joins materials together. Since it does not use adhesives or filler materials, contamination issues due to impurities do not occur. Additionally, it can suppress the occurrence of plastic deformation. By using diffusion bonding, it is possible to create hollow structures, internal flow paths, and deep holes with good straightness that cannot be achieved with conventional machining. We have a helium leak tester, so leak testing can also be conducted. 【Materials with Diffusion Bonding Achievements】 - Alumina - Aluminum nitride - Quartz glass - Silicon - SiSiC composite material - Pure molybdenum - Pure nickel We are also developing other materials. We are distributing a collection of processing examples using bonding, so please take a look. Shapes that were previously difficult to achieve may be possible by combining diffusion bonding with machining. If you have such parts, please feel free to contact Top Seiko. *The "Company Profile" was updated in December 2022. Please download it along with the "Bonding Processing Example Collection" from the link below.

• Processing Contract

In connectors that connect various hardware such as automobiles, industrial equipment, and communication devices, low-cost Sn-plated products are widely used. However, there are also cases where attention is needed regarding the reliability specific to Sn-plated contacts. In this webinar, based on actual connector failure cases that have occurred in the market, we will explain the process leading to the identification of causes for typical failure modes such as: - Whiskers (short circuit failures) - Fretting wear (contact failures) Furthermore, we will systematically introduce the organization of failures through the FTA (Fault Tree Analysis) of the entire connector, as well as each failure mechanism. ■ Technical content to be explained: - FTA structure of connector failures - Mechanism of whisker formation and evaluation methods - Mechanism of fretting wear and evaluation methods ■ Introduction of future evaluation technologies: - High-temperature and high-humidity fretting wear testing (scheduled for introduction in December 2026)

Understanding TLM Overview It has become increasingly clear that traditional RTL modeling techniques alone are insufficient for the design and verification of large-scale ASICs/SoCs and FPGAs. As a result, the concept of Transaction Level Modeling (TLM) has been widely adopted, and it has become essential in verification methodologies such as UVM. In this webinar, we will introduce TLM using terminology explanations and implementation examples with simple sample designs.

＼Utilizing HPLC Analysis and Separation for More Efficient Synthetic Research／ We will hold a webinar where you can attend the content that was well-received at the seminar held in July. ▶Reduction of analysis time ▶Efficiency in impurity analysis ▶Expansion of HPLC/LC-MS utilization ▶Introduction of automation and the latest workflows In a special lecture, Dr. Kanako Kumada from the Catalysis Chemistry Research Division of the National Institute of Advanced Industrial Science and Technology will present on "Autonomization of Organic Synthesis Experiments - Aiming for Transformation of Research Processes." 【Event Overview】 ▶Date: Thursday, August 20, 2026 ▶Time: 15:00 - 16:45 (Streaming starts at 14:45) ▶Venue: Online ▶Participation Fee: Free We look forward to the participation of everyone considering improvements in analytical efficiency in synthetic research and the expansion of HPLC and LC/MS utilization.

Coherent Japan will exhibit at the 2026 International Welding Show. Dates: September 16 (Wednesday) - 19 (Saturday), 2026 Venue: Tokyo Big Sight, West Hall 1, Booth 1-06 At the Coherent booth, we will showcase advanced photonics technologies that support laser processing. We will display innovative solutions that underpin high output, high efficiency, and high reliability of lasers, including semiconductor laser products such as the new air-cooled diode laser system "COMPACT EVO AC," bars, fiber-coupled lasers, VCSELs, and advanced materials applied in thermal management. Experience the technological prowess of Coherent that supports a wide range of industries, including laser processing, electronic components, automotive, EV, and sensing fields.

Top Seiko Co., Ltd. will be exhibiting at the 10th Adhesive and Joining EXPO held at Makuhari Messe. This specialized exhibition focuses on adhesive and joining technologies essential for the manufacturing industry, covering everything from dissimilar material bonding to general applications. The accompanying seminars will introduce industry trends, initiatives from various companies, and products and case studies from exhibitors. We sincerely look forward to your visit.