Added silicone adhesive and sealant "TSE322S" to AD-Chemi.
Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability.
A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials.
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