Conformal coating agent

Addition-curing silicone is widely used in various industrial fields such as potting, bonding, coating, and molding of electronic components due to its excellent heat resistance, electrical insulation, and weather resistance. However, in the field, troubles such as "it doesn't cure even though I mixed it according to the recipe," "only the surface is sticky and doesn't cure," and "only the parts that come into contact with specific jigs or substrates experience curing failure" occur quite frequently. Many of these phenomena are referred to as "cure inhibition." Cure inhibition is not due to the poor quality of the silicone itself, but rather occurs when trace amounts of chemicals contained in the surrounding environment or contact materials interfere with the function of the catalyst responsible for the curing reaction. Even trace amounts of the causative substances can have an impact, making it difficult to identify the cause, which can lead to significant yield loss and complaints in the production site. Chapter 1: Curing Mechanism of Addition-Curing Silicone Chapter 2: What is Cure Inhibition? Mechanism of Occurrence Chapter 3: Main Causative Substances and Sources of Cure Inhibition Chapter 4: How to Identify Cure Inhibition and Practical Countermeasures Summary For more details, please check our company website.

Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability. A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials. For more details, please check our website.

Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.

The Momentive product "TSE398" is a one-component, fast-curing, non-corrosive silicone adhesive sealant that cures with moisture in the air. After curing, it forms an elastic silicone rubber and exhibits excellent adhesion to copper, various metals, plastics, ceramics, glass, and more without the need for a primer. It has high fluidity and is designed for easy injection, making it widely applicable from waterproof sealing of electrical and electronic devices to general adhesive applications. - Non-corrosive: Complies with MIL-A-46146B corrosion testing. - Safe to use on highly corrosive metals such as copper and brass. - Fast curing: Tack-free time is only 10 minutes (at 23°C). - Low odor: Releases alcohol vapors during curing (significantly less odor compared to acetate-based products). - Primerless adhesion: Direct adhesion to a wide variety of substrates is possible. - Wide temperature range: Suitable for high and low temperature environments from -55°C to +200°C. - Excellent weather resistance, ozone resistance, and chemical resistance. - Outstanding electrical insulation properties: Ideal for sealing high-voltage components. - One-component formulation for easy handling. For more information, please visit our website.