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  3. DIAMET CORPORATION
  4. We will exhibit at "TECHNO-FRONTIER 2026 41st Power System Exhibition"!
SEMINAR_EVENT
  • Sep 03, 2026
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Sep 03, 2026

We will exhibit at "TECHNO-FRONTIER 2026 41st Power System Exhibition"!

DIAMET CORPORATION DIAMET CORPORATION
Daiyamet Co., Ltd. (Headquarters: Higashi-ku, Niigata City, President: Hiroshi Iii) will exhibit at the "TECHNO-FRONTIER 2026 41st Power Supply System Exhibition" held at Tokyo Big Sight from July 15 (Wednesday) to 17 (Friday), 2026, showcasing the isolated DC-DC converter circuit method "TriMagiC Converter (TM)" that simultaneously achieves high power, high conversion efficiency, and miniaturization. At this exhibition, we will display prototype boards of 1.6kW and 3.3kW isolated DC-DC converters using the TriMagiC Converter (TM) circuit method, as well as introduce a lineup of pressed powder cores for transformers and resonant coils. Since last year, we have expanded our product lineup and will propose magnetic materials suitable for various applications, including high permeability and low loss materials. Additionally, we will showcase a mock-up of the PoL (Point of Load) converter for AI servers, which is being developed in collaboration with the Yamamoto Masayoshi Laboratory at the National Institute of Technology, Nagoya University. By viewing the actual size, visitors can experience the potential for high power density and miniaturization required for next-generation power supplies.
Date and time Wednesday, Jul 15, 2026 ~ Friday, Jul 17, 2026
09:30 AM ~ 05:00 PM
Capital Tokyo Big Sight West Hall 1 1-Y02
Entry fee Free
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Miniaturizing the power supply board to 2/3! New circuit topology for improving efficiency with general-purpose Si.

【Technical Data Presentation】Reducing costs while miniaturizing and improving efficiency without SiC/GaN. "Simple Calculation Tool" available for design assistance!

Solving issues such as "limitations of substrate area" and "cost increase due to SiC adoption." Our unique operating mode reduces magnetic component size by one-third without increasing frequency. We achieve dramatic downsizing while suppressing heat and noise. 【Challenges and Applications We Can Address】 ◎ Space Constraints: Reducing substrate area by two-thirds and magnetic components (such as transformers) by one-third (for applications like in-vehicle chargers, robotic joints, and 1U-sized communication boards). ◎ Cost Control: Achieving high efficiency using general-purpose silicon without relying on expensive SiC/GaN. ◎ Heat and Noise Mitigation: Halving ripple current and reducing magnetic flux density (ΔB) for low loss and low noise. 【Features of Our Unique Topology】 Adopting low permeability powder core "MBS" with "ON-ON / ON-OFF" modes. By suppressing the amplitude of the excitation current, we have made it possible to minimize transformers and capacitors. ★【Free Offer】Simple Calculation Tool & Technical Materials We are distributing a tool that allows you to instantly estimate "how much smaller it can get under your conditions." You can view detailed measurement data and more from the <Catalog Download>.

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Ultra-compact DC-DC circuit technology Insulated Tri-Magic Converter (TM)

Significantly miniaturized and made more efficient insulated DC-DC converters through ON-ON / ON-OFF operation modes [Simple calculation tool and technical materials provided].

This method uses a low permeability powder core "MBS" in the main transformer and adopts ON-ON / ON-OFF operating modes, enabling the miniaturization of magnetic components to about 1/3 and the power board size to about 2/3 compared to conventional circuits (according to our estimates). In addition to achieving space-saving in the power circuit without increasing the operating frequency, further miniaturization is possible by increasing the operating frequency. It is possible to achieve a compact and high-efficiency DC-DC converter without using SiC or GaN, while still using general-purpose Si. 【Features】 ■ Realizes miniaturization and high efficiency of DC-DC converters (power circuits) ■ By suppressing the amplitude of the excitation current, it also achieves a reduction in ΔB (change in magnetic flux density) and the resulting low loss ■ The output ripple current is approximately halved compared to conventional technology, allowing for a reduction of the output capacitor by half ★ We are currently offering a simple calculation tool. Please contact us if you are interested. You can also view technical materials by clicking the "Download Catalog" button. ★ We will be exhibiting at the Techno Frontier Power System Exhibition and will also be speaking at the organizer's seminar. For more details, please refer to the basic information section.

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Related catalog(7)

Magnetic materials / E-core / Resonant coil core lineup list

Magnetic materials / E-core / Resonant coil core lineup list

PRODUCT
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Power supply board miniaturized to 2/3! New circuit technology TriMagiCConverter(TM) for high efficiency with general-purpose Si - Comprehensive catalog (Japanese version)

Power supply board miniaturized to 2/3! New circuit technology TriMagiCConverter(TM) for high efficiency with general-purpose Si - Comprehensive catalog (Japanese version)

CATALOG
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Technical Data: ON-ON & ON-OFF Operating Modes Ultra-Compact, High-Efficiency DC-DC Converter

Technical Data: ON-ON & ON-OFF Operating Modes Ultra-Compact, High-Efficiency DC-DC Converter

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[Advanced Edition] TriMagiC Converter (Introduction to the transformer design and operation verification of a 1.6kW prototype using design tools)

[Advanced Edition] TriMagiC Converter (Introduction to the transformer design and operation verification of a 1.6kW prototype using design tools)

TECHNICAL
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[Principle Edition] TriMagiC Converter (Isolated DC-DC Converter) Technical Documentation

[Principle Edition] TriMagiC Converter (Isolated DC-DC Converter) Technical Documentation

TECHNICAL
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Magnetic material core lineup

Magnetic material core lineup

PRODUCT
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Ultra-Compact Topology ”Isorated TriMagiC Converter(TM)”

Ultra-Compact Topology ”Isorated TriMagiC Converter(TM)”

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October 26 (Monday) to 31 (Saturday), 2026" Notice of Participation in "JIMTOF2026

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  • SEMINAR_EVENT

Yamawa Manufacturing Co., Ltd. will exhibit at "JIMTOF 2026, the 33rd Japan International Machine Tool Fair," which will be held at Tokyo Big Sight from October 26 (Monday) to October 31 (Saturday), 2026. We will be showcasing two new products from our highly acclaimed ultimate professional tool "Z-PRO," optimized for machining! Don’t miss this opportunity to visit our booth. 【Highlights】 We will display two new products from the "Z-PRO" brand. We have prepared many short videos to solve tapping troubles! We will thoroughly explain examples of failures and successes in tapping. Live demonstrations using the precision tapping machine 'TTTsystem' will be available.

Sep 11, 2026

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[Seminar] What is the next competitive axis for AI data centers?

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  • SEMINAR_EVENT

[Speaker] Masanori Hayashi Evangelist, NTT Docomo Business, Inc. Visiting Researcher, GLOCOM, International University [Key Lecture Content] The application areas of AI are expanding from generative AI to AI agents and physical AI, while the main battlefield of AI infrastructure is shifting from learning-centric to inference-centric. Against the backdrop of rapidly growing AI demand, investments and entries into AI data centers by various businesses are accelerating. However, new challenges are emerging, such as increasing power and cooling demands, responses to data sovereignty, and the utilization of GX strategy regional systems for data center aggregation. This lecture will overview the latest trends in the AI data center market and investment trends, as well as organize technological innovations such as GPUs, liquid cooling, and all-optical networks, along with policy and institutional trends and industrial challenges. Furthermore, it will envision the future of a decentralized AI infrastructure that connects AI factories, data centers, and the edge, and discuss new industrial foundations and future competitive axes through watt-bit collaboration.

Sep 11, 2026

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[Seminar] Unraveling New Trends in Energy Procurement for Data Centers from Japan's Growth Strategy

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  • SEMINAR_EVENT

[Speaker] Ren Taro Hayashi, Senior Manager, Environmental, Energy, and Resource Strategy Group, Research and Consulting Division, Japan Research Institute, Ltd. [Lecture Items] 1. Overview of Data Centers 2. Impact of Data Centers on the Power Industry 3. Policy Trends in Data Centers and Power (1) GX2040 Vision (2) Watt-Bit Collaborative Public-Private Discussion (3) GX Industry Location Working Group (4) Japan Growth Strategy 4. Future Approaches to Power Procurement for Data Center Development 5. Q&A / Business Card Exchange

Sep 11, 2026

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Holding an exhibition on wood and living.

  • NEW
  • SEMINAR_EVENT

This year, we will be holding the large exhibition "Wood and Living Expo" organized by Nice! Approximately 150 domestic housing and building material manufacturers will gather to showcase the latest equipment and noteworthy new products. Additionally, many specialized seminars will be held to learn about the latest industry trends and future outlooks! It will be a two-day event filled with business tips and seeds for new proposals. We sincerely look forward to your visit. ■ Dates: October 15, 2026 (Thursday) 10:00-17:00 October 16, 2026 (Friday) 10:00-16:00 ■ Venue: Pacifico Yokohama, Hall C&D ■ Organized by: Nice Co., Ltd., Wood and Housing Research Association, and the Trustworthy Renovation Promotion Association ■ Official website: https://woodlivingfair.jp/ ■ Pre-registration: https://www.tenjikai-uketsuke.com/form/wood-living-expo-2026/ *Pre-registration is required for attendance. When registering, please select "R&D Center" as the Nice department.

Sep 11, 2026

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[Seminar/Training] Regulations Related to Chinese Medical Devices: Seminar on New China GMP Explanation

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  • SEMINAR_EVENT

In November 2025, the revised "Good Manufacturing Practice (GMP) for Medical Devices" in China will be announced, with implementation scheduled for November 2026. Local experts will provide a clear explanation of the key points for compliance. < Seminar Topics > - Overview of China's new GMP - Differences from ISO 13485:2016 - New requirements that require particularly careful measures - Anticipated inspection styles

Sep 11, 2026

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