Proposal for Cost Reduction of Gold Plating | Supports Film Thickness, Partial Plating, and Lot Optimization
At Kodama Co., Ltd., we propose the optimization of film thickness, plating range, substrate specifications, and processing lots to maintain the quality of gold plating while keeping costs down. The price of gold plating can fluctuate significantly based on surface area, film thickness, gold market prices, and quantity. By reviewing unnecessary film thickness, changing from full plating to partial gold plating, and optimizing substrate specifications and masking methods, it may be possible to reduce the amount of gold used and processing costs.
We cater to electronic components, terminals, connectors, contacts, and semiconductor-related parts. We can assist with everything from prototypes to mass production, including pure gold plating, hard gold plating, partial gold plating, thick gold plating, and gold plating on SUS.

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