[Exhibition Announcement] Information on EdgeTech+ 2026 Participation

Renesas RZ/G3L SMARC Module

The Adsmc7101 is a compact, cost-effective SMARC System-on- Module (SoM) measuring 82 x 50 mm, based on the Renesas RZ/ G3L or RZ/G3SE processor. As the computing core is provided as a pre-validated SoM, it enables rapid integration into a wide range of embedded systems while reducing development time and risk. The module features up to four Arm Cortex-A55 cores as the main processor and an Arm Cortex-M33 core as a secondary processor. This architecture enables simultaneous execution of advanced computing tasks such as image processing and realtime monitoring and control applications. For Linux environments, the module supports the Civil Infrastructure Platform (CIP) long-term maintenance distribution, providing not only long-term product availability but also extended security support throughout the product lifecycle. Advanet also offers professional services including: ・ Firmware customization tailored to application requirements ・ Carrier board development ・ Complete system design including enclosure design Development kits combining the module with an evaluation carrier board are also available.

• Embedded Board Computers

Renesas RZ/G3L Slim Industrial Computer

The AdiCS7102 is a compact industrial box computer based on the Renesas RZ/G3L or RZ/G3SE processor. Despite its slim form factor of only 140 x 135 x 29.5 mm, it provides a rich set of industrial interfaces including Ethernet, USB, RS-232C, RS-485, CAN-FD, and multiple display outputs. The platform is ideal for applications such as HMI systems and sensor data aggregation. The system integrates up to four Arm Cortex-A55 cores as the main processor and an Arm Cortex-M33 core as a subprocessor, enabling advanced processing tasks such as image processing while simultaneously handling real-time monitoring and control functions. For Linux-based applications, the AdiCS7102 supports the Civil Infrastructure Platform (CIP) long-term maintenance kernel, helping ensure long-term product availability and security support throughout the product lifecycle. Customization of the enclosure and I/O interfaces is also available upon request.

• Industrial PCs
• Embedded Board Computers

Renesas RZ/G3L Compact Industrial Motherboard

The AdiMB7103 is a compact industrial motherboard based on the Renesas RZ/G3L or RZ/G3SE processor. It supports a wide range of interfaces required for industrial computing applications, including Ethernet, USB, RS-232C, RS-485, CAN-FD, and multiple display outputs, making it ideal for HMI systems and sensor data aggregation applications. The platform integrates up to four Arm Cortex-A55 CPU cores as the main processor and an Arm Cortex-M33 core as a subprocessor. This architecture enables advanced processing tasks such as image processing while simultaneously performing realtime monitoring and control functions. For Linux-based applications, the AdiMB7103 supports the Civil Infrastructure Platform (CIP) long-term maintenance kernel, providing both long-term product availability and extended security support throughout the product lifecycle. Customization of interfaces and board form factors is also available upon request.

• Embedded Board Computers

NVIDIA RTX PRO 6000 up to 3 units × AMD EPYC equipped high-performance AI processing 4U GPU server

Features of the "Mayflower-II-SP5 - GPU Server": - High-performance computing with AMD EPYC 9005/9004 processors - Capable of supporting up to 2 NVIDIA RTX PRO 6000 Blackwell Max-Q Workstation Edition GPUs (optional support for up to 3) - 2 PCIe x16 expansion slots - Robust industrial design supporting continuous operation 24/7 - Equipped with mounting clamps and washable air filters

• server

Supports one NVIDIA L4 GPU, NVIDIA RTX-4000 ADA, or NVIDIA RTX-2000 ADA.

<Features> ■General-purpose server platform for AI engines ■Removable storage bay ■High expandability ■Advanced cybersecurity: IEC62443-4-1/-4-2 SL2 certification obtained ■Support for 1x NVIDIA RTX -2000 ADA, 1x RTX-4000 ADA, or 1x NVIDIA L4 ■2x 2.5Gb Ethernet ports (RJ45) supporting TSN (Time Sensitive Network)

• server

Industrial multi-service IoT gateway certified with IEC 62443-4-2 cybersecurity!

<Features> ■ Modular gateway (supports a wide range of configuration options) ■ Equipped with ARM NXP i.MX8M Plus QuadLite ■ Compatible with EVERYWARE GREENEDGE ■ Obtained IEC 62443-4-2 cybersecurity certification ■ Intuitive cloud provisioning and device management ■ Global cellular support enables connectivity worldwide, 4G LTE compatible (5G capable) ■ Open platform and cloud certified ■ Compact design, fanless structure, optimized for DIN rail

• Other network tools

28-port 10G L3 Ethernet switch

<Features> ■4x 10GbE SFP+ ports & 24x Gigabit ports ■Advanced QoS support (SPQ, WRR, SPQ + WRR): Hierarchical shaping & scheduling and bandwidth management at the port and queue level ■VLAN mirroring function ■Network redundancy with LACP, STP, RSTP, MSTP, and quick ring failover protection ■Wide operating temperature range: -40℃ to +75℃ ■Compliant with IEC 61850-3 / IEEE 1613 ■Diverse variations of input power and port configurations

• Routers, Switches, and Hubs

EN 50155 Standard L2 Managed

Fast Ethernet compatible M12 D-coded copper port x8 (with IEEE 802.3af/at compliant PoE PSE functionality)

• Routers, Switches, and Hubs

CC-Link IE TSN low-profile PCI Express add-in card, also installable in standard height.

AdEXP1589 is an intelligent CC-Link IE TSN manager/local board of the low profile PCI Express add-in card type. CC-Link IE TSN adopts TSN (Time-Sensitive Networking) technology in CC-Link IE to achieve more accurate time synchronization and high-speed, high-precision control, while also enabling excellent real-time communication even in networks with multiple mixed protocols. It is installed in a PCI Express slot and functions as a CC-Link IE TSN manager/local station. The CPU on this board provides offloading capabilities for CC-Link IE TSN, minimizing the increased load on the host CPU due to the implementation of CC-Link IE TSN communication. By changing the bracket, it can be installed in both low profile and standard height slots. *Note: AdEXP1589 is a product under development.

• Embedded Board Computers

VMEbus CPU board equipped with NXP QorIQ LS1023A/LS1043A SoC

■ QorIQ LS1023A/LS1043A SoC equipped, Cortex-A53, 2/4 cores, 1.4GHz/1.6GHz ■ ECC support, DDR4 1600MT/s, 8GB max, onboard implementation ■ PMC / XMC 1 slot or 3 USB3.0 ports ■ microSD (SDXC) card socket ■ Gigabit Ethernet 4 ports ■ RS232C 1 port, RS232C/RS485 3 ports ■ VME master/slave compatible ■ 6U size, 1 slot width ■ Operates on a single 5V power supply ■ VxWorks7

• Embedded Board Computers

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will be exhibiting at "EdgeTech+ 2026," which will be held at Pacifico Yokohama from November 18 (Wednesday) to November 20 (Friday). This time, we will showcase our new product, the Renesas RZ/G3L equipped SMARC module, as well as motherboards and slim industrial computers that utilize this module. We will introduce solutions aimed at improving development efficiency through a common platform, as well as considerations for mass production and long-term operation. Additionally, we will display a wide range of products, including various embedded boards, IoT gateways, edge AI computers, short-depth 19-inch servers, and CRA-compliant products, along with examples of custom development aimed at solving customer challenges. We invite you to stop by our booth during this opportunity! ■Booth Number: Pacifico Yokohama Exhibition Hall 3-8 ■For more details: https://www.advanet.co.jp/mec-events/edgetech2026/

[Speaker] Hideo Ishihara, Specially Appointed Professor at Gifu University, National University Corporation Tokai National Higher Education and Research System Former Head of Semiconductor Division at Denso [Lecture Topics] 1. The Discovery of Quantum Mechanics and the Invention of Semiconductor Technology 2. Advanced Semiconductor Manufacturing (TSMC, Kumamoto JASM, Chitose Rapidus in Hokkaido, and Global Trends) 3. A 100-Year History of Computers and AI Semiconductors (CPU, GPU, NPU, Photonic-Electronic Integration) 4. A 100-Year History of Mobility and Semiconductors 5. Mobility (Autonomous Driving) and Semiconductors (Edge AI, Chiplets) 6. Mobility (Electrification) and Semiconductors (IGBT, SiC, GaN, Ga2O3, Diamond) 7. The Impact of Nobel Prize Research on "Quantum Entanglement" and "Bell's Inequality" 8. The Transformation of Future Society Seen from AI to AGI: Where is Humanity's Place? Living with Dreams 9. Q&A

[Key Lecture Content] 1. Circular Economy Policy Centered on Plastic Resource Circulation Strategy Keiko Osawa, Deputy Director, Resource Circulation Economy Division, GX Group, Ministry of Economy, Trade and Industry - Transition to a circular economy against the backdrop of economic security and decarbonization - Trends in system development through the Plastic Resource Circulation Promotion Act and others - Formation of the recycled plastic market and strengthening the competitiveness of the resource circulation industry - Progress and achievements of the plastic resource circulation strategy so far - Future policy directions towards realizing a circular economy and expectations for the private sector - Q&A / Business card exchange 2. JEPLAN's Initiatives in PET Chemical Recycling and Future Prospects Masaki Takao, President and CEO, JEPLAN Inc. - Domestic and international trends and challenges surrounding PET resource circulation - Features of JEPLAN's PET chemical recycling technology - Efforts towards achieving bottle-to-bottle recycling - Funding from the GX Promotion Organization and business expansion - Future prospects towards realizing resource circulation and a decarbonized society - Q&A / Business card exchange

[Key Lecture Content] 1. Direction of Bioindustry Policy and Future Priorities Ayako Yukawa, Deputy Director (General) of the Biological Chemistry Industry Division, Ministry of Economy, Trade and Industry 1. Global Trends Surrounding the Bioindustry 2. Japan's Strengths and Challenges to Overcome 3. Direction of Bioindustry Policy at the Ministry of Economy, Trade and Industry 4. Q&A / Business Card Exchange 2. The Future of Bio-Manufacturing Opened by Industrial Smart Cells - Industrial Transformation through Integrated Biofoundry Akihiko Kondo, CEO of Bacchus Bioinnovation 1. Trends in Bio-Manufacturing and the Potential of Industrial Smart Cells 2. Creation of Smart Cells through AI, Robotics, and Data-Driven Biofoundries 3. Comprehensive Technological Foundation from Microbial Breeding to Manufacturing Process Development 4. Resource Utilization of CO2 and Untapped Biomass and Prospects for Industrial Transformation 5. Q&A / Business Card Exchange