[8/28 Tokyo] Advantech Design-In Forum 2018

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

• server

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

• Industrial PCs

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

• Industrial PCs
• Embedded Board Computers

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs
• Embedded Board Computers

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

• Industrial PCs

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session