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  4. [8/28 Tokyo] Advantech Design-In Forum 2018
SEMINAR_EVENT
  • Aug 07, 2018
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Aug 07, 2018

[8/28 Tokyo] Advantech Design-In Forum 2018

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At this year's forum, we will have speakers from key players in the IoT field, such as Microsoft Japan and Arm, who will present on themes centered around edge x cloud. Additionally, we will introduce a more luxurious program than in previous years, which will include various solution-ready packages (SRPs) utilizing Advantech's latest edge computing solutions across different verticals. Advantech Design-In Forum (ADF) 2018 Event Overview [Tokyo Venue] Date and Time: August 28, 2018 (Tuesday) 13:15 - 19:00 (Registration and Exhibition: 12:00 -) Venue: Tokyo Conference Center Shinagawa 4F http://www.tokyo-cc.co.jp/access_shinagawa.html Capacity: 150 people Participation Fee: Free Contact: Advantech ADF Secretariat Phone: 0800-500-1055 (Toll-Free) Email: ajp_marcom@advantech.com
Date and time Tuesday, Aug 28, 2018
01:00 PM ~ 07:00 PM
Capital Venue: Tokyo Conference Center Shinagawa 4F http://www.tokyo-cc.co.jp/access_shinagawa.html
Entry fee Free
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EIS-DK10 1 20161201153212.jpg

Edge Intelligence Starter Kit【EIS-DK10】

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

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MIO-5272.jpg

3.5-inch Single Board Computer SBC [MIO-5272]

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

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ARK-3520P.jpg

6th Generation Intel Core Industrial Embedded PC ARK-3520P

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

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  • Embedded Board Computers

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ARK-1124C%20Double_Front%20left%20_S2017112715343220180110101043.jpg

Intel Celeron Small Industrial Embedded PC ARK-1124C

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

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AIMB-275.jpg

Mini-ITX Motherboard [AIMB-275]

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

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EPC-S201_Front IO _S20180521175110.jpg

Fanless Embedded Single Board Computer [EPC-S201]

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

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MIO-5391.jpg

3.5-inch Single Board Computer SBC [MIO-5391]

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

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Images obtained with the Invitrogen EVOS S1000 Spatial Imaging System.

Introducing a highly reproducible biomarker analysis method utilizing spatial information with the EVOS S1000 Spatial Imaging System "Cancer Biomarker Discovery 2026."

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Cancer Biomarker Discovery 2026 is an online seminar focused on the latest biomarker discovery and analysis technologies in the field of cancer research. Advanced technologies that support the understanding, diagnosis, and treatment research of cancer, such as liquid biopsy, proteomics, and spatial omics analysis, will be introduced. This seminar primarily targets basic and clinical researchers involved in cancer research, as well as those interested in biomarker discovery and analysis. In our section, we will introduce the latest techniques in fluorescent imaging for spatial biology and spatial proteomics research, centered around the Invitrogen EVOS S1000 Spatial Imaging System. Unlike traditional microscopy, which is limited in multiplex immunostaining, our spectral unmixing technology enables simultaneous imaging of up to 9 colors, allowing for rapid data acquisition with minimized sample damage. Additionally, we will explain a practical workflow using direct conjugate antibodies and TSA-based Invitrogen Aluora amplification reagents, proposing high-reproducibility analysis methods that leverage spatial information. For research use only. Not for diagnostic use.

Feb 05, 2026

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Examples of images obtained with the Invitrogen EVOS S1000 Spatial Imaging System.

Free Online Seminar "Spatial Biological Analysis Realized with EVOS S1000 and HALO"

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In spatial biology/spatial proteomics research, the coexistence of "high-quality multiplex fluorescence image acquisition" and "reliable quantitative analysis" is becoming increasingly important. This webinar, co-hosted by Thermo Fisher Scientific and Indica Labs, will introduce a practical workflow that allows for a comprehensive understanding from imaging to analysis. Recommended for: - Those interested in spatial biology/spatial proteomics research who want to systematically understand the entire process from imaging to analysis. - Those who are already conducting or considering the implementation of multiplex imaging (multiplex immunostaining). - Those who feel limited by traditional four-color fluorescence observation and wish to engage in higher-dimensional spatial information analysis. This is a free seminar, so please join us. *For research use only. Not for diagnostic use.

Feb 05, 2026

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[Seminar] Latest Market Trends and Mass Production Competition of QDEL in 2026

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[Speaker] Shinya Okimoto, Founder & CEO of Okiwa Studio LLC [Lecture Topics] Part 1: The tectonic shifts in the display industry and the market potential of QDEL Part 2: Business solutions to the "three major technical challenges" for the practical application of QDEL Part 3: Winning strategies for Japanese companies: Targeting the "high value-added components" sector Part 4: Redefining the business portfolio towards 2030 Part 5: Q&A

Feb 04, 2026

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[Seminar] Trends in Nuclear Power at Home and Abroad and Key Points to Note

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[Lecturer] Mr. Kenji Kimura, Chief Researcher, Nuclear Group, Power Unit, Japan Energy Economics Research Institute (JEA), and Research Strategy Group, Research Strategy Unit [Key Lecture Content] In recent years, the role of nuclear power has been highlighted in the context of global warming countermeasures and energy security, and more recently, in response to the increased electricity demand due to the use of AI and the expansion of data centers. Under these circumstances, new movements are being observed in countries that utilize nuclear power. In the United States, investments in nuclear power by IT companies are becoming more active, while in Europe, measures are being promoted to enhance the feasibility of new projects. In Japan, the role of nuclear power has been clarified once again, and discussions surrounding specific institutional measures are gradually progressing. This lecture will provide an overview of these movements and organize the trends that should be noted in the future. [Lecture Items] 1. Global Situation and Nuclear Power 2. Trends in Other Countries 3. Trends in New Reactor Development 4. Domestic Trends and Challenges 5. Key Points to Watch After 2026 6. Q&A / Business Card Exchange

Feb 04, 2026

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Exhibiting at Manufacturing World Nagoya 2026!

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At our booth, we will mainly showcase the following products: 〇 Our original product T-Arm 〇 Tecnospiro's product Spider 〇 Knight Global's product Air Balancer 〇 A drone for equipment inspections ▽------------------------------------------------------------▽ From April 8 (Wednesday) to April 10 (Friday) at Port Messe Nagoya ■ Manufacturing World Nagoya (Booth Number: 16-40) https://www.manufacturing-world.jp/nagoya/ja-jp.html ■ Pre-registration for attendance is convenient! https://www.manufacturing-world.jp/nagoya/ja-jp/register.html?code=1603005193330205-52G △------------------------------------------------------------△ We look forward to your visit.

Feb 04, 2026

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  • 安全、効率、経費削減。 現場の課題、お持ちのテプラでまるっと解決。 TEPRA
  • 義務化された熱中症対策に取り組む製造現場、工場、物流倉庫へ 排気熱風なく室温-4.1℃※の冷風を 工事不要で暑さ対策 気化式スポットクーラー Pure Drive ピュアドライブ ※環境条件…室温35℃/湿度50%/風量「中」
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