[8/30 Nagoya] Advantech Design-In Forum 2018

Delivering everything needed for industrial IoT in one package. Start IoT immediately.

A one-package solution that includes the necessary edge systems for IoT, IoT software platform services (WISE-PaaS), wireless I/O modules, sensors, and pre-configured Microsoft Azure services. Suitable for creating POCs for IoT application development, such as predictive maintenance applications for factories.

• server

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer

6th Generation Intel Core U Series 3.5' MI/O-Compact Single Board Computer ● Supports Intel 6th Generation Core U Series (i7/i5/i3/Celeron), 2 x DDR3L-1600/1333 SODIMM with a maximum of 16 GB ● DirectX 11.3, OpenGL 4.4, OpenCL 2.1, supports independent display of 3 screens: VGA + LVDS + HDMI ● Flexible design using integrated multiple I/O: MIOe expansion allows for designs suitable for specific market applications and retention of proprietary know-how ● 2x Gigabit Ethernet, HD Audio, rich I/O interfaces (2 COM, 2 SATA, SMBus/I2C, GPIO, 2 Full-size Mini PCIe (one with mSATA), 4 USB 2.0, 2 USB 3.0, and TPM 2.0) ● Intel AMT 11.0, WISE-PaaS/RMM, and embedded software API

• Industrial PCs

"Fanless | Rugged | Abundant I/O" 3 independent screen displays | Wide range: 9~36V | -40 to 85℃ | VGA/HDMI

Advantech's ARK series adopts a modular design that can meet various customer requirements for industrial embedded IoT applications, offering not only I/O customization but also innovative software packages that include cloud and AI analytics suites. 【Key Features of This Product】 ◆ Equipped with 6th generation Intel Core i3/i5/i7 processors ◆ Three independent display outputs: VGA + HDMI + optional display ◆ DDR4 SO-DIMM memory (up to 32 GB) ◆ Flexible expandability via PCI/PCIe x 4 ◆ Wide range input power supply of 9-36V ◆ Diverse I/O with 6x high-speed USB 3.0 and 8x COM ports ◆ 2x removable 2.5-inch HDD drive bays ◆ Compatible with Advantech iDoor modules

• Industrial PCs
• Embedded Board Computers

Fanless | Ultra-compact | Rugged | Abundant I/O Mini-PCIe | 4 COM | 12~24V | -20 to 60°C | VGA

Advantech's fanless embedded computer ARK series features a highly durable chassis with IP40 dust protection, 5G vibration resistance, and 50G shock resistance, along with an extended MTBF (Mean Time Between Failures). This series has obtained various safety certifications, including CE, FCC, CCC, UL, BSMI, and CB, allowing it to be sold in countries that enforce strict safety standards. 【Main Features of the Product】 ◆ Intel Celeron N3350 Dual-Core SoC ◆ VGA display, 4x RS-232/422/485, 2 x USB3.0 ◆ 1x full-size mini PCIe for communication modules ◆ 1 x 2.5-inch SATA III SSD/HDD, 1 x half-size mSATA ◆ Wide temperature range: -20 to 60℃ ◆ Lockable 12V DC input power supply ◆ 12-24V power module (optional) ◆ Advantech iDoor compatible two-layer module ◆ Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs
• Embedded Board Computers

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151.

Supports 7th & 6th generation Intel Core i7 / i5 / i3 LGA 1151 ● OS: Compatible with WindowsR 10 IoT ● Equipped with Intel Q170 / H110 chipset, supports 7th & 6th generation IntelR Core i processors (LGA1151) ● 260-pin SO-DIMM x2, maximum 32GB DDR4 2133 MHz SDRAM ● Supports triple display via VGA / DP / HDMI / LVDS (eDP) ● Supports PCIe x16 (3rd generation), 1 F/S miniPCIe, 1 M.2 (NGFF), 6 USB 3.0, and 3 SATA III ● Compatible with a wide range of 12V-24V DC input ● Supports Intel vPro, AMT 11.0, PECI 3.0, software RAID 0,1,5,10, TPM 1.2 / 2.0 (optional) ● Supports WISE-PaaS/RMMlR and embedded software API

• Industrial PCs

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System

Intel Atom N3350 DC Barebone Embedded Single Board Computer Fanless Slim System - Intel Atom N3350 Dual-Core SoC - Semi-industrial fanless slim system, DIN rail or wall mount design - VGA display, COM port, USB 3.0 x2, LAN x1 on the front - DIO port x1, COM port x1 on the side - Compatible with Advantech WISE-PaaS/RMM

• Industrial PCs

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

In this webinar, we will explain "Why packed columns continue to be chosen today" from a practical perspective of gas analysis. We will also introduce the various types and characteristics of packing materials offered by Restek, along with application examples, and share insights on how to make optimal choices based on analytical objectives. Furthermore, we will discuss the differences in hardware passivation techniques and how to differentiate their use, as well as examples of custom packed column designs tailored to specific purposes. Topics covered in the webinar: ✅ Types of packing materials for packed columns and their characteristics ✅ Differences in separation selectivity based on analytical examples for each packing material ✅ Examples of custom packed column designs Benefits: For beginners: You will gain an understanding of separation selectivity based on differences in packing materials and the basics of column selection. For intermediate and advanced users: You will gain a concrete understanding of how to select packing materials and the usefulness of custom packed columns to improve separations that do not satisfy with existing columns. Participant benefits: We will provide a collection of packed column applications that are not publicly available.

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

In "The Principles of Mixing and Defoaming and Key Points for Recipe Setting," we will explain the mechanism of the self-rotating and orbiting mixer, Awatori Nentaro, and the principles of mixing and defoaming in an easy-to-understand manner for beginners. ◇ Why do materials mix just by combining centrifugal force? ◇ What does it mean that mixing and defoaming can be processed simultaneously? ◇ How do the materials inside the container move during operation? This content is recommended for those who usually use Awatori Nentaro in their work but have never heard about its mechanism or principles and want to learn about it on this occasion. We will also explain temperature management based on material viscosity and considerations for operating conditions with examples. Additionally, in the "Legal Self-Inspection and Basic Maintenance Training," participants will have the opportunity to experience basic maintenance such as round belt replacement and legal self-inspection (regular self-inspection) using actual equipment. The capacity for each seminar is different, so please apply early! ◆ Date and Time: April 24, 2026 (Friday) 13:00 - 16:30 ◆ Venue: Hiroshima Convention Hall