We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

For polishing various substrates and for fine burr removal in punched areas.

Super Finisher flat surface grinding allows even beginners to subtly differentiate the use of laps on the back side of the stamper original plate, and the environment is clean. The stamper back surface grinding device polishes the back side of the stamper using a lapping film. The clamping and unclamping of the workpiece is done by the operator, while roll grinding, pad grinding, brush cleaning, and air blowing are performed automatically. The various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. *Features* 【Stamper Back Surface Grinding Device】 - Various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. - The circumference of the roll grinding can be randomized with pad grinding. - Once the conditions are set, even beginners can operate it easily. 【Thin Plate Flat Surface Grinding Device】 - The film width can be selected according to the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched parts. - If a sub-table is provided, external setup can be done during processing time. *For more details, please download the materials or contact us.*

• Special Processing Machinery
• Other machine tools
• Wafer processing/polishing equipment

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

• Wafer processing/polishing equipment

Are you having trouble improving the accuracy of surface roughness? Sample tests for film polishing are available!

Are you having trouble improving surface roughness accuracy? Would you like to try the benefits of film polishing? You can polish quickly and easily without the hassle of the fine touch required in grinding with grinding wheels! 【For example, in the following cases】 ■ You want to improve roughness accuracy without worrying about changes in diameter or height dimensions. ■ You have performed grinding with grinding wheels, but it is still insufficient. – Final polishing is needed! ■ You want to finish with film polishing, skipping the grinding wheel process from the turning marks. ■ You want to roughen a surface that is too smooth. ■ You want to remove foreign substances attached to the surface. ■ You have tried various methods but they haven't worked well. ■ Polishing new materials or thin items seems unlikely to succeed without film polishing. *For more details, please request materials or view the PDF data from the download.

• Processing Contract

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

• Wafer processing/polishing equipment

Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.

The color filter protrusion correction device corrects protrusion defects on color filters. Using the protrusion height measurement system of this device, protrusions are polished to the allowable height through point grinding correction. It is also possible to automate the process by connecting an inspection device. In that case, based on the protrusion data, protrusion confirmation is performed, the shape of the protrusion is recognized, the polishing center position is corrected, and protrusion correction is reliably carried out. It is also possible to add a retry function. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

Maximizing the features of the wrapping tape makes the intended polishing easy.

As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

In public construction civil engineering sites, there are many instances where sheets are used as common temporary facilities, such as construction roads, access roads, heavy machinery work yards, material storage areas, and worker pathways. Traditionally, steel plates were common, but due to their weight, transportation and installation can be cumbersome. Hyper CLT sheets are civil engineering materials made from wooden CLT for civil engineering use. The 5×10 sheet weighs about 230 kg, and the 5×20 sheet weighs about 460 kg, making them lightweight and easy to transport, install, and remove, even with small machinery. They can be widely utilized for temporary roads, heavy machinery scaffolding, pathways within the site, and protection of material storage in public works. Since they are made of wood, they also contribute to environmental aspects such as reducing summer heat reflection, lowering noise, and fixing CO2. They can simultaneously address construction efficiency, safety measures, and environmental considerations, making them effective for innovative proposals in public works. Furthermore, they improve transportation efficiency and reduce labor in site operations as an alternative to steel plates. Hyper CLT sheets are registered technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS "TH-250021-A." They are recommended for companies considering civil engineering, civil engineering use, and civil engineering CLT. Feel free to request materials or consult about implementation. They are temporary materials that also help improve site evaluations in public works. Please consider them.

We have released a new video on our company’s YouTube channel. The theme of this video is "The World of Amino Acid-Based Shampoos." Amino acid-based shampoos have become popular in recent years, but the lather, feel, and finish can vary greatly depending on the cleansing ingredients used. In this video, we clearly explain the changes in user experience based on the differences in cleansing ingredients by comparing two types of amino acid-based shampoos. We hope you can use this as a hint for developing original shampoos and differentiation.

New York and Tokyo, June 26, 2026 - (JCN Newswire) - This year's successful listing of PayPay Corporation (hereinafter "PayPay") on NASDAQ has provided a significant boost. The question now facing Japan's leading innovation companies is no longer "Is a U.S. listing feasible?" but rather "How can we attract global capital and build companies that align with global growth strategies?" The 2nd Japan Go IPO Summit will be held on September 16, 2026, at the Grand Hyatt Tokyo to address this question. This summit is hosted by MarcumAsia and organized by AUM Advisors. To register for this invitation-only event, please apply here: Japan GO IPO Summit Attendee Information https://events.marcumasia.com/view.php?id=32

Our company representative, Shibata, will be speaking as a lecturer at the "Mikata Project" AI Utilization Seminar for the automotive industry, hosted by the Chubu Bureau of Economy, Trade and Industry. ■ Title: AI Implementation Course Leading to Results - Learning Success Patterns and Practical Processes from Real Examples in Manufacturing Sites "We implemented AI, but it is not being used on-site and is left unattended" and "The implementation has become the goal without yielding results" - we have seen many such stumbling blocks in manufacturing sites. In the seminar, based on real examples, we will discuss common patterns for successful implementation that lead to results, pitfalls to avoid, and practical processes to ensure AI is continuously used. We will also propose specific measures for sites struggling with technology transfer and dependency on individuals. ■ Event Overview Date: July 3, 2026 (Friday) 13:30 - 16:00 Venue: TKP Meitetsu Nagoya Station Conference Center + Online Participation Fee: Free / Application Deadline: June 30 (Tuesday) Organizer: Chubu Bureau of Economy, Trade and Industry (Automotive Industry "Mikata Project") Co-presenter: Satoru Hayami, Waseda University For details and registration, please visit the official page of the Chubu Bureau of Economy, Trade and Industry. If you are struggling with AI implementation in manufacturing sites, please feel free to consult us, regardless of region or industry.

July 16 (Thursday) 10:00 AM - 6:00 PM Venue: Convex Okayama Small Exhibition Hall