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  5. Wafer processing/polishing equipment
  6. Tape-type centerless ultra-finish grinding machine CLP-300

Tape-type centerless ultra-finish grinding machine CLP-300

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CLP-300

last updated:May 30, 2025

サンシン
サンシン
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Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

    Wafer processing/polishing equipment
01_clp.JPG

Tape-type centerless ultra-finish grinding machine CLP-300

01_clp.JPG
01_clp.JPG
  • Related Link - http://www.kksanshin.co.jp/

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basic information

**Features** - Tape grinding allows for management of roughness below 0.4z. - No need for troublesome dressing work. - Setup change time is under 5 minutes, making it ideal for a variety of products and small lots. **Specifications** - Number of control axes: 2 axes (up/down, left/right) - Workpiece outer diameter: φ6–40mm, φ40–100mm - Workpiece length: 10–300mm - Grinding tape width: 25.4mm, 50.8mm - Power supply: AC200V, 11KVA - Equipment size: Length 750 × Depth 1,300 × Height 1,900mm - Equipment weight: 700kg For more details, please contact us or refer to the catalog.

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Applications/Examples of results

【Applications】 ○ Various straight shafts for automobiles and construction machinery ○ Motor shafts (individual shafts) ○ Rollers for printers, etc. (rubber, resin, metal) ○ Inspection pin gauges, etc. ● For more details, please contact us or refer to the catalog.

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Before considering device implementation, film polishing sample testing.

Before considering device implementation, film polishing sample testing.

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We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

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We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

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サンシン

サンシン

Manufacturing and processing contract

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Sanshin Co., Ltd. responds to the demands of a new era with trusted specialized technology. We are the comprehensive and largest professionals in precision surface processing machines. When it comes to manufacturing in Nagaoka, the creation of devices and machinery is one key point, but at Sanshin, we believe that responding to the ever-changing needs of the times and utilizing our unique precision processing technology to meet the diverse and advanced requests of our customers is the essence of "monozukuri" (manufacturing). At Sanshin Co., Ltd., we have developed our own unique technology in collaboration with wrapping manufacturers based on our technology, experience, and many years of achievements in the production of film polishing machines. As a result, we have researched and developed high-quality, highly reliable ultra-precision polishing systems in various mechatronics fields, from the electronic industry to automotive industry components such as shafts and gears, responding widely to user needs. "Be a big koi in a small pond." Although our recognition is still low and the market is small, we aspire to continue being an innovator in nanotechnology and to promote the creation of valuable products as a leading company in the industry.

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