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  3. NITTA DuPont Incorporated
  4. Basic Knowledge: Types of Grinding Processes
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  • Jan 09, 2019
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Jan 09, 2019

Basic Knowledge: Types of Grinding Processes

NITTA DuPont Incorporated NITTA DuPont Incorporated
Polishing is a technique for flattening or creating a mirror finish on the surface of the workpiece. There are various principles and methods of polishing. - Chemical polishing: A method that primarily utilizes the etching action of chemical solutions to remove distortions from the workpiece surface. It does not use abrasive particles. Example: electrolytic polishing. - Mechanical polishing: A method that utilizes the cutting action of hard tools holding fine abrasive particles, to achieve flatness or a mirror finish on the workpiece. Example: grinding. - Chemical mechanical polishing (CMP): A composite process that combines the chemical dissolution action of polishing liquids with the mechanical removal action of abrasive particles. This method, represented by CMP, is used for flattening processes in semiconductor manufacturing, but it originally applied technology for mirror finishing of silicon wafers. The manufacturing processes for semiconductor devices require extremely high precision, reaching atomic levels of 0.1 micrometers. There are various other polishing methods, but the chemical mechanical polishing provided by Nitta Haas is one of the most precise ultra-precision polishing techniques.
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IC1000(TM)画像.jpg

Foam Polyurethane Pad "IC1000(TM)"

The de facto standard for polishing pads in the CMP process. World market share No. 1!

There have been numerous successful adoptions to date, and we continue to maintain a high market share. The IC1000(TM) is designed based on special materials, manufacturing, and processing technologies, as well as advanced application evaluation techniques, ensuring optimal performance.

  • Other abrasives

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EXTERION(TM)画像.jpg

Foam Polyurethane Pad "EXTERION(TM)"

Polishing pads optimal for primary polishing in mirror surface finishing.

The EXTERION(TM) series is a polyurethane foam pad created from advanced foam control technology. It is used for primary polishing of silicon wafers and compound substrates, providing a high-quality finish and reliable polishing performance. Additionally, its special processing technology demonstrates excellent thickness precision and startup performance.

  • Other abrasives

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不織布パッド『SUBA』.JPG

Non-woven fabric pad "Suba(TM)"

A non-woven fabric-based polishing pad that responds well to various applications.

"Suba(TM)" is a polishing pad made from polyester fibers, with polyurethane impregnated into a non-woven fabric formed by a dry process. It demonstrates excellent performance primarily for primary and secondary polishing of silicon wafers, sapphire wafers, and oxide wafers. It can also be used for edge polishing and notch polishing, and offers a wide range of products tailored to each process. 【Features】 ■ High polishing rate ■ Low defect rate ■ High flatness *For more details, please refer to the catalog or feel free to contact us.

  • Wafer processing/polishing equipment
  • Hand polishing and filing
  • Other abrasives

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H1000画像.png

Soft Pad "H1000"

Polishing pad for achieving defect-free finishes

The H1000 series pad was developed as a pad for final polishing of silicon wafers. Its unique resin design demonstrates excellent scratch performance, and the straight pore structure achieves high stability and long life.

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Nanopure(TM)画像.jpg

Precision Grinding Slurry "Nanopure(TM)"

Polishing slurry that achieves nano-level surface quality.

The Nanopure(TM) series is a polishing slurry primarily used for primary polishing, secondary polishing, finishing polishing, and edge polishing of silicon wafers. The abrasive particles are made of high-purity colloidal silica, achieving excellent polishing performance through an optimal blend of additives. We will propose the most suitable product lineup based on your objectives and applications.

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Machplaner(TM)画像.jpg

Precision Grinding Slurry "Machplaner(TM)"

Polishing slurry that achieves a high polishing rate and good surface quality.

Through abrasive formulation technology and additive formulation technology based on colloidal silica, we achieve high polishing rates and high surface quality. We offer a lineup of products tailored to various polishing purposes and applications, including sapphire, glass, quartz, oxides, and resins. We will propose the optimal product lineup based on your objectives and applications.

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Related catalog(3)

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Pad" Product Catalog

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Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

Nitta Dupont Co., Ltd. "CMP Polishing Slurry" Product Catalog

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Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

Nitta Dupont Co., Ltd. "Diamond Conditioner" Product Catalog

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■■ Portable Hydrogen Leak Detector | HDA-0100 series ■■ Compact, lightweight, and battery-operated for easy portability. Despite being handheld, it enables high sensitivity and wide-range "hydrogen measurement."

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The 【 HDA-0100 series 】 currently available from Fukuda Corporation is a "Portable Hydrogen Leak Detector." ■ Compact and lightweight, convenient for carrying (approximately 400 g, including battery) ■ Battery-operated and cordless (continuous usage time of approximately 8 hours) ■ High sensitivity and wide range (0.5 ppm to 5000 ppm) hydrogen measurement is possible in a handy type It has features such as these. "What is a Hydrogen Leak Detector?" It is a tester that can measure leaks in small areas that could not be measured in air leak tests and can also identify leak points. It uses a tracer gas consisting of 5% hydrogen and 95% nitrogen, an industrial mixed gas (non-flammable gas: ISO10156:2017). For more details, please refer to the links below for related links, product information, and catalogs.

Jun 03, 2026

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■■ Device-mounted Hydrogen Leak Detector | HDZ-0201 series ■■ A highly sensitive airtightness inspection machine that uses hydrogen gas. Designed for easy integration into equipment. External dimensions: W 93 × D 91 × H 97 mm

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The HDZ-0201 is a hydrogen leak detector designed for installation in equipment. It is used to measure the overall leakage from the entire inspected item (workpiece). - The atmospheric pressure chamber method involves covering the workpiece with a chamber, filling the inside of the workpiece with tracer gas, allowing the leaked gas to accumulate in the chamber, stirring the leaked gas, and forcing circulation to measure the gas concentration with a hydrogen detector. - The vacuum chamber method allows for high-sensitivity measurements by evacuating the chamber and then introducing atmospheric air into the chamber, directing the gas to the hydrogen detector. There are two methods available. It features a compact and lightweight design that is easy to integrate into equipment. Additionally, its concentration resolution capability is ultra-high sensitivity up to 0.1 ppm (depending on set conditions and environmental conditions). Detection principle: Semiconductor type Detection sensitivity: Equivalent to 1×10⁻⁶ Pa·m³/s (depending on inspection conditions and measurement environment) Usage: Equipment-integrated type (dedicated for installation in equipment) Resolution: 0.1 ppm Power supply voltage: DC 24 V External dimensions: W 93 × D 91 × H 97 mm

Jun 03, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without the application of heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Jun 03, 2026

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Please take a look at Fukuda's gas leak test (hydrogen leak and helium leak)!

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● What is a hydrogen leak detector? It can measure leaks in small areas that could not be detected in air leak tests and can also identify the leak locations. It is a detector that uses a mixture of 5% hydrogen and 95% nitrogen (non-flammable gas: ISO10156:2017) as the tracer gas. ● What is a helium leak test system? It is a leak test system suitable for high-precision or high-pressure leak inspections. The helium leak test system uses helium gas as the detection gas (tracer gas) and detects the helium that has leaked out. It is the leak test method among Fukuda's leak testers that can detect the smallest leaks.

Jun 03, 2026

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■■ Vial Leak Testing Device | MSQ-2002 series ■■ The definitive non-destructive testing alternative to "submersion testing" for pharmaceutical packaging (various vials, bottles, eye drops, cylindrical containers, etc.). Complies with vial integrity testing (JP18, USP <1207>).

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Introducing a "non-destructive testing device as an alternative to the submerged test" for pharmaceutical packaging products. "Complete vial leak testing device | MSQ-2002 series" Fully automating leak tests for various vials, bottles, eye drops, and cylindrical containers. Please check the link below for videos and catalogs.

Jun 02, 2026

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