Hot Melt Molding for Waterproofing and Dustproofing, as well as Miniaturization of M2M/IOT Sensors

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

We introduce the adoption of hot melt molding technology that demonstrates excellent sealing performance by directly injecting sustainable hot melt adhesives made from natural fatty acids into electronic components. □ Adoption Examples Waterproofing and dustproofing of circuit boards, waterproof connectors, sensor harnesses, harnesses, switches, etc. □ Benefits of Adoption 1. Reduction in the number of components 2. Reduction in the amount of resin used 3. Shortening of processing time ◆ If you would like a collection of case studies, please download the catalog. ◆ If you would like a sample of the actual product, please contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

• Other electronic parts
• plastic
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

• Other electronic parts
• plastic
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

• EMS
• Coating Agent

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.

"I want to use hot melt molding, but I can't install the equipment." For such customers, our factory has installed nine hot melt molding machines, and we will perform hot melt molding on the insert work provided by the customer. We can provide a comprehensive response, including selection of sealing agents, prototyping, mold manufacturing, and contract sealing processing. Available hot melts: - Polyamide-based - Polyolefin-based - Reactive polyurethane-based ◆ If you are interested, please feel free to contact us.

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

Our company has 20 years of experience in hot melt molding and utilizes 3D CAD/CAE systems to design, manufacture, and sell molds specifically for hot melt molding. ◆Please feel free to contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

Numerous examples of achieving value analysis (VA) by replacing the two-component potting process with hot melt molding are published! This is a technical case study document summarizing these examples from a process perspective. ■ Currently, we are offering technical documents and various case studies for free! ■ 【Published Information】 ■ Differences between potting and hot melt molding ■ Process flow implementation - Potting process ■ Process flow implementation - Hot melt molding ■ Application 1: Waterproof sealing of LED fixtures ■ Application 2: Waterproof sealing of micro switches ■ Application 3: Waterproof sealing of temperature sensors

• Other electronic parts
• Other polymer materials
• Coating Agent

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.

By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.

• Other electronic parts
• Other polymer materials
• Coating Agent

We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

• Other electronic parts
• Processing Contract
• Coating Agent

Introduction to the hot melt molding method that completes 4 waterproof connectors in 30 seconds.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

• Automotive Connectors
• Processing Contract
• Coating Agent

LED module waterproof sealing! A case of process improvement through switching from potting.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

• Other electronic parts
• Other molds
• Coating Agent

Introducing a case where low melting viscosity hot melt was used for sealing IC tags.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

• Other electronic parts
• Processing Contract
• Coating Agent

Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.

Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*

• Other electronic parts
• Processing Contract
• Coating Agent

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

• Other electronic parts
• Processing Contract
• Coating Agent

Waterproofing, insulation, and dustproofing for electrical components! We are currently offering a free collection of 'case studies and technical materials' filled with tips and know-how for process improvement!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! 'Hot Melt Molding' is a groundbreaking new technology for waterproof processing of circuit boards and electronic components that significantly reduces processing time compared to traditional methods. The sealing agent is primarily made from natural fatty acids derived from grains, making it excellent for sustainability. Our case study collection includes numerous examples where switching from potting to hot melt molding has led to reduced processing time and cost savings. Technical materials provide know-how on hot melt molding and waterproof processing of circuit boards and electronic components, including comparisons and benefits over traditional methods. ■ Currently, we are offering three types of case studies and two types of technical materials as a free gift ■ [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Materials (10 pages) ■ [Technical Material] Achieving VA by Switching from Potting (7 pages, 3 cases) * Please view the 'Hot Melt Molding Case Study Collection & Technical Materials' PDF available for download.

• Other electronic parts
• Processing Contract
• Coating Agent

【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

Hot melt molding, which is expanding its adoption for waterproof applications in electrical components. The MK series from Matsumoto Processing is a molding machine developed specifically for hot melt molding. It is compact and user-friendly, and has been introduced in many customers' factories. Additionally, we can accommodate customization and dedicated design of equipment according to customer requirements. Furthermore, we also support automation, including fully automatic inline machines. ◆ We have various devices on display at our prototype lab in Fuji City, Shizuoka Prefecture. Customers wishing to visit should contact us.

• Molding Equipment
• Other polymer materials
• Coating Agent

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The wooden lightweight sheet "Hyper CLT Sheet," utilizing CLT (Cross Laminated Timber), is a sponsor of the Masters Koshien (Okayama). The Masters Koshien is where those who have experienced high school baseball come together across generations to pursue their goals once again. We resonate with their "attitude of continuing to challenge" and support their activities from Okayama. The Hyper CLT Sheet is a product created to provide a new option in civil engineering sites, which have primarily relied on steel sheets until now. It is lightweight, easy to handle, and features the environmental value unique to wood. Furthermore, it is registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A,"** aiming for widespread adoption in various sites, starting with public works. Wood, NETIS, civil engineering, CLT, wooden lightweight sheets. We will continue to support challenges in both the field and sports from Okayama. Masters Koshien (Okayama) https://masters-okayama.com/

Features: ● Intel Core Ultra (Series 2) processor LGA 1851 socket (CPU sold separately) ● DDR5 6400MT/s dual-channel support, CU/U-DIMM x2 (up to 128GB) (memory sold separately) ● M.2 M-Key x1, E-Key x1 ● USB 3.2 x4, USB 2.0 x8 ● Intel Ethernet Controller I226-V (2.5GbE) x2 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCI Express Gen5 x16 x1, PCI Express Gen4 x4 x1, PCI Express Gen4 x1 x1 * This model does not include memory, storage, or OS.

Features: ● Intel Core Ultra 200S series processor LGA 1851 socket (up to 125W) (CPU sold separately) ● DDR5 6400MT/s dual-channel compatible, CU-DIMM/U-DIMM x4 (up to 256GB) (sold separately) ● M.2 M-Key x2, E-Key x1, B-Key x1 ● USB 3.2 x8, USB 2.0 x6 ● 2.5GbE LAN x3 ● SATA 6Gb/s x2 (supports RAID 0 / 1 / 5) ● PCIe Gen5 x16 x1, PCIe Gen4 x4 x2, PCIe Gen4 x1 x1 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.

Features: ● Supports Intel Core Ultra 200S series processors with Intel H810 chipset and LGA1851 socket (up to 125W) (CPU sold separately) ● DDR5 CSO-DIMM x2 (up to 128GB) (memory sold separately) ● 2.5GbE LAN x2 ● HDMI x2, DisplayPort x1, LVDS/eDP x1 (supports simultaneous output of up to 3 screens) ● SATA 6Gb/s x4, M.2 M-Key x1, M.2 E-Key x1, M.2 B-Key x1, PCI Express Gen5 x16 x1 ● USB 3.2 Gen2 x2, USB 2.0 x8, RS-232/422/485 x1, RS-232 x5 ● Compatible with ATX power supply * This model does not include memory, storage, or OS.