【Product Introduction Webinar on August 3 (Monday) from 13:30 to 14:00】Introduction of the Intel 8th Generation Ultra-Low Power Core i7 Compatible Single Board Computer MIO-5373.

2 x RS-232, 2 x RS-232/422/485 (power and isolation specifications), 2 x USB 2.0

- 4 COM support ±15kV air gap ESD protection: COM1: RS-232/422/485 (isolation, RS-485 automatic flow control), COM2: RS-232/422/485 (Wake on Ring, RS-485 automatic flow control, 12V/5V power supply (selectable via jumper)), COM3/4: RS-232 (Wake on Ring) - Supports 2 x USB2.0 via internal box wafer connector - Optional rear I/O connector (coastline or internal connector) support - Compatible with MIO-ultra single board computer

• Embedded Board Computers

2-Port Isolated Protection CAN Bus MIOe Module

- Simultaneous operation of two individual CAN networks - High-speed transmission up to 1 Mbps - 16 MHz CAN controller frequency - Reliability ensured by a 2500 VDC optical isolation protection system - Automatically assigned I/O addresses via PCI PnP - LED indicators for transmit/receive status on each port - Includes Windows DLL library and examples - Drivers and utilities for Windows CE5/CE6/XP/7 - Supports Linux 2.4.xx / 2.6.xx; QNX 6.3x/6.4.x/6.5.x on Intel x86 hardware platforms - 2-port CAN-Bus MIOe module (with isolation protection)

• Embedded Board Computers

Equipped with Intel Pentium N4200, Celeron N3350, and Atom E3950/E3940/E3930.

- Intel Pentium N4200 & Celeron N3350, Atom E3950, E3940, E3930, supports up to 8 GB of DDR3L 1867 MHz - DirectX 12.0, OpenGL 4.3, OpenCL 2.0, supports independent display on 3 screens: VGA + LVDS/eDP + HDMI/DP* - Flexible design using integrated multiple I/O: By using MIOe expansion, it is possible to design suitable for specific market applications and retain proprietary know-how - 2 Intel i210 Gigabit Ethernet, rich I/O interfaces (4 COM, 2 SATA, 2 USB 3.0, SMBus/I2C, GPIO full-size Mini PCIe, full-size mSATA) - Supports iManager, RMM, and embedded software API

• Embedded Board Computers

7th generation Intel Core mobile processors, i7, i5, i3 3.5-inch SBC in size 14cm x 10cm.

- 7th generation Intel Core i7 / i5 / i3 + PCH QM175 - Dual channel DDR4 2400, up to 32GB (ECC option) - 1 Intel i210 GbE & 1 Intel i219 GbE with iAMT support - Rich I/O: 2 COM, SATA, USB 3.0, SMBus / I2C, 16-bit GPIO - Full-size mini PCIe or mSATA / M.2 E-key supporting NVME - 12V power input - Full-size mini PCIe or mSATA / M.2 E-key - NVME compatible (optional) - iManager, WISE-PaaS/RMM, emb. SW API support

• Industrial PCs
• Embedded Board Computers

AMDG Series SoC GX-210JA/GX-415GA Pico-ITX Single Board Computer

- Supports embedded AMD G series SoC GX-210JA/GX-415GA with a maximum Quad-Core processor, and supports DDR3/DD3L 1600MHz up to 8GB. - Outstanding graphic performance: Supports DirectX 11.1, independent dual display (18-bit LVDS + VGA or 18-bit LVDS + HDMI). - Flexible design with integrated diverse I/O: MIOe module that leverages domain expertise for specific markets. - Rich I/O interfaces: 2 COM, 1 SATA, USB 3.0, PCIe Mini Card, and mSATA. - Supports SUSIAccess and embedded software API.

• Embedded Board Computers

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe

Intel Pentium N4200 / Celeron N3350 Pico-ITX, full-size mini PCIe ● Supports Intel® Pentium N4200/Celeron N3350 embedded, DDR3L 1866MHz up to 8GB ● Compatible with Intel 7th generation DirectX 11.1, dual independent displays: 18/24bit LVDS, VGA, DP/HDMI ● Flexible design using multiple integrated I/O: MIOe approaches vertical applications while maintaining domain expertise ● Rich I/O interfaces with Intel GbE support, 2 COM, 1 SATA, 4 USB 2.0, GPIO, SMBus, I2C, and MIOe expansion interface ● Supports SUSIAccess and embedded software API

• Industrial PCs

Single board computer featuring high reliability and abundant I/O equipped with Intel Celeron & Atom.

Advantech's embedded single board computer (SBC) series includes a lineup of 2.5-inch PICO-ITX, 3.5-inch SBC, and PC/104 form factors. The embedded SBC series features a full range of computer products with rich embedded functionalities and robust designs, aimed at advancing product development while reducing design burdens and project complexities. In addition to a wide range of integrated services, embedded SBCs can also be provided for specialized applications in various domains for AGV and AMR. **Key Features of This Product** - Intel Celeron J1900 & Atom E3825/E3845, DDR3L-1333MHz 2/4GB onboard - Dual display support: HDMI, VGA, LVDS - CPU bottom-up design for system integration and robust design for various factory environments - 3x Intel i210 GbE (eMMC onboard), rich I/O: 4x COM, SATA, USB3.0, SMBus/I2C, 16-bit GPIO, full-size mini PCIe/M.2 E-key, half-size mSATA, 12V/24V power input, SIM card holder

• Industrial PCs
• Embedded Board Computers

MIOe Evaluation Board (for MIO-2262)

MIOe Evaluation Board (for MIO-2262) Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O extension design guidelines - Utilizes standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

Evaluation board for MIO-3260

Evaluation Board for MIO-3260 Specifications and Features - Complete and flexible interface for verification - Accelerates customer carrier board development - All circuit designs follow MI/O expansion design guidelines - Uses standard EPIC form factor - Interfaces: 1 x DP, 1 x PCIe, 1 x mini PCI, 1 x SIM holder, 1 x USB 3.0, 4 x USB 2.0, 1 x LPC, 1 x SMBus, 1 x I2C, 1 x HD audio line input, 1 x HD audio line output, 1 x HD audio microphone input, powered 1 x SATA, 8-bit GPIO, PWR/HDD LED, PWR/reset button, inverter, +12V power input

• Industrial PCs

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC)

MIOe Evaluation Board (for MI/O-Compact and MI/O-Ultra SBC) Specifications and Features - Compatible with both MI/O-Compact SBC and MI/O-Ultra SBC - All circuit designs conform to the MI/O Expansion Design Guide - Mechanical design for diverse applications - Complete and flexible interface for verification - Uses standard ATX form factor - Interfaces: 3 PCIe x1, 1 DP, 1 mini PCI, 1 SIM, 1 USB 3.0, 1 USB 2.0, 1 LPC, 1 SMBus, 1 LineOut (with amplifier), system fan, +12V power input

• Industrial PCs

DC to DC power module MI /O chassis compliant from 9 to 36V

Specifications and Features DC power module MI/O compliant with 9-36V DC chassis

• Industrial PCs

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the AUTOMOTIVE ENGINEERING EXPOSITION 2026 YOKOHAMA. At this exhibition, we will be showcasing testing equipment such as Air Leak Tester for EV and Equipment Mounted Type Hydrogen Leak Detector. We sincerely hope you will take this opportunity to visit us. Yours sincerely, [Official Site] https://aee.expo-info.jsae.or.jp/en/yokohama/ [DATES] Wednesday, May 27, through Friday, May 29, 2026 10:00 a.m. - 5:00 p.m. [VENUE] PACIFICO Yokohama, Exhibition Hall, Booth No. ２７４ ※Online Exposition Website：Tuesday, May 19, through Tuesday, June 9, 2026

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

We will be exhibiting at the J AGRI (J Agri) / Agricultural Materials EXPO held at Gran Messe Kumamoto from May 22 (Wednesday) to May 24 (Friday), 2024. 【Booth Number】: B1-43 Outdoor Exhibition Area Japan's largest comprehensive exhibition for agriculture and livestock, Agricultural WEEK, will be renamed J AGRI starting in 2024. This is a place where you can actually see, touch, and compare products. At our booth, we will showcase our lightweight resin flooring boards "JULIGHT / SUPER JULIGHT / RAKURAKUBAN" along with new products. Starting with the agricultural-specific flooring board "RAKURAKUBAN," which can be easily laid in various scenes such as around greenhouses, agricultural work sites, temporary parking lots, for the movement of agricultural machinery and light trucks, and for protecting truck beds, there are various ways to use the lightweight resin flooring boards "JULIGHT / SUPER JULIGHT series." We offer a variety of sizes and protrusion shapes tailored to customer needs, and they are lightweight enough to be carried by hand, with excellent impact resistance, as well as superior water resistance, weather resistance, and durability, providing outstanding features not found in plywood or steel plates. We sincerely look forward to your visit.

[Speaker] Toshio Fujimura, Ph.D. (Engineering) Representative, Touson Automotive Strategy Research Institute Automotive and Environmental Technology Strategy Analyst Visiting Professor, Aichi Institute of Technology [Former Toyota Motor Corporation] [Lecture Topics] <Chapter 1> Urgent Issue: CO2 Reduction Cannot Wait! <Chapter 2> Achieving a 48% Reduction in CO2 by 2030 Compared to 2019 is Impossible Without Carbon Neutrality in Fuels as Well as Electricity <Chapter 3> Technical Challenges in Electrification <Chapter 4> Pathways to Achieve a 48% Reduction in CO2 Emissions from Owned Vehicles by 2030 <Chapter 5> The Intentions Behind Electrification Strategies of Various Governments (Mainly in Europe, the U.S., and China) <Chapter 6> Electrification Strategies of Major Global Automakers and Sales Trends in Different Regions: Which Manufacturers Will Survive by 2030? <Chapter 7> Conclusion

[Speaker] Masayuki Sawada, Director of Sawada Masayuki Engineering Office [Lecture Topics] 1. The battle in Ukraine is the first large-scale drone war in history. 2. The battle in Iran also sees drones shifting the paradigm of strategy and tactics. 3. Efforts by major European countries (producing drones in Ukraine and collaborating with Ukrainian drone manufacturers). 4. Efforts by the United States (providing intercept drones and other support to Ukraine). 5. Efforts by Taiwan (producing drones in collaboration with U.S. manufacturers that have combat experience in Ukraine). 6. Efforts by Japan's Ministry of Defense (establishing a multi-layered coastal defense system using drones [SHIELD]). 7. Efforts by Japan's Terra Drone Corporation (collaborating with Ukrainian drone manufacturers). 8. Q&A / Business card exchange.