Webinar (2/18): This week! "Visualization Solutions for Mold Interiors" in Semiconductor Resin Encapsulation and IoT Technology.
The first webinar "Visualization of the Inside of Molds" hosted by Kistler Japan is finally approaching this Thursday. Using a CG video as an example of the semiconductor encapsulation process, we will quantify the internal state of the mold, which can be considered a black box, and provide detailed know-how for improving major molding defects and enhancing production processes. Kistler's piezoelectric pressure sensors are highly advantageous and are optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding.
Please check the details through the link below and register via the registration form.
https://info.kistler.com/ja-webinar-sealed-molding
Additionally, it may be helpful to view the technical explanation page below in advance for better understanding.
https://info.kistler.com/sealed-molding-ja
We look forward to the participation of many people.

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You can register for the webinar from the Kistler Japan homepage.
This is the technical page related to the content of this webinar.
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