Webinar (2/25): This week! "Visualization Solutions for Mold Interiors" in Semiconductor Resin Packaging and IoT Technology.
The second webinar "Visualization of the Inside of Molds" hosted by Kistler Japan is finally approaching this Thursday. Using the semiconductor encapsulation process as an example, we will quantify the internal state of the mold, which can be considered a black box, with CG videos, and provide detailed know-how on improving major molding defects and enhancing production processes. Kistler's quartz piezoelectric internal pressure sensors, which have a high advantage, are optimal for the conditions of semiconductor encapsulation. We will also propose sensing technologies to improve major molding defects using quartz piezoelectric sensors effective for low-pressure measurements, such as epoxy transfer molding.
Please check the details through the link below and register using the registration form.
https://info.kistler.com/ja-webinar-sealed-molding
Additionally, it may be helpful to view the technical explanation page below in advance for reference.
https://info.kistler.com/sealed-molding-ja
We look forward to many participants joining us.

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You can register for the webinar from the Kistler Japan homepage.
This is the technical page related to the content of this webinar.
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