A new HES board ideal for prototyping and emulation of medium to large-scale ASIC/SoC designs.

Prototyping board equipped with multiple Xilinx UltraScale+, UltraScale, and Virtex-7.

The "HES-7" is an FPGA board equipped with multiple Xilinx UltraScale+, UltraScale, Virtex-7, and Zynq devices. We offer a variety of prototyping boards, including the "HES-UltraScale 440," which features FMC connectors for flexible expandability, and the "HES-UltraScale 1320," which supports up to 79 million ASIC gates. Additionally, we provide a fully automated and scalable hybrid verification environment for SoC/ASIC design called "HES-DVM." 【Features (HES-XCVU9P-ZU7EV)】 ■ Equipped with Xilinx Virtex UltraScale+ XCVU9P and Xilinx Zynq UltraScale+ XCZU7EV ■ Includes standard interfaces such as QSFP28, PCIe 3.0, and Gigabit Ethernet ■ Adopts FMC connectors for flexible expandability *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services
• Other information systems

A prototyping board equipped with two of the largest Virtex UltraScale+ and one Zynq UltraScale+.

The HES-VU19PD-ZU7EV is a unique combination featuring two Virtex UltraScale+ VU19P FPGAs as logic modules and one Xilinx Zynq UltraScale+ ZU7EV MPSoC as a host module. It is equipped with a quad-core ARM Cortex-A53, a dual-core ARM Cortex-R5 real-time processing unit, an ARM Mali-400 MP2 GPU, an integrated H.264/H.265 video codec, and UltraScale+ programmable logic. This board targets high-speed physical prototyping and emulation for medium to large-scale ASIC designs. The HES-VU19PD-ZU7EV provides 83M ASIC gates and can reach up to 316M gates through the backplane. The board includes five SODIMM external memory slots, with four connected to the VU19P device and one to the ZU7EV device. The on-chip memory for the VU19P device is 166Mb, while the ZU7EV device has 11Mb.

• ASIC

Features ● PICO-ITX standard ● Equipped with Intel Core Ultra 7 255U / Ultra 5 225U ● 16/32GB onboard memory ● 2.5GbE + 1GbE ● HDMI 1.4 + eDP 1.4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA) ● M.2 2230 E-Key x 1 (PCIe 4.0 [x1] + USB 2.0) ● USB 3.2 Gen 2 x 2 + USB 2.0 x 2 ● RS-232/422/485 x 2 ● TPM, GPIO 4-bit, SATA 6Gb/s x 1 ● SMBus/I2C (Default: SMBus) ● Intel AMT Support * This model does not include storage or OS.

Features: ● PICO-ITX standard ● Equipped with Intel Atom x7433RE/x7835RE ● DDR5 4800MHz×1 (up to 16GB) (sold separately) ● HDMI 1.4×1, eDP 1.4b/LVDS×1 ● 2.5GbE×1, GbE×1 ● Full-Size mSATA, M.2 2230 E-key x1 ● USB 3.2 Gen2[x1]×2, USB 2.0×4 ● RS-232/422/485×2, RS-232×2 ● TPM 2.0, SATA 6.0Gbps×1, GPIO 4-bit, SMBUS/I2C×1 * This is a model without an operating system.

Features: ● Equipped with Intel Processor N150 / Intel Core 3 Processor N355 ● DDR5 4800MHz SODIMM ×1 (supports up to 16GB) (sold separately) ● HDMI 1.4 ×1, eDP 1.4b / LVDS ×1 ● Intel Ethernet Controller I226 (2.5GbE RJ-45 ×1), Realtek RTL8111H (1GbE RJ-45 ×1) ● Full-size mSATA / mPCIe ×1, M.2 2230 E-Key ×1 ● USB 3.2 Gen2[x1] ×2, USB 2.0 ×4 ● RS-232/422/485 ×2, RS-232 ×2 ● TPM 2.0, SATA 6Gb/s ×1, 4-bit GPIO, SMBus / I2C ×1 ● Fan-equipped heat sink available separately PICO-ASL4-FAN01: Heat sink with fan PICO-ASL4-HSK01: Heat sink PICO-ASL4-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure) * This is a model without an operating system.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.