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  3. アルデック・ジャパン
  4. A new HES board ideal for prototyping and emulation of medium to large-scale ASIC/SoC designs.
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  • Jul 19, 2021
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Jul 19, 2021

A new HES board ideal for prototyping and emulation of medium to large-scale ASIC/SoC designs.

アルデック・ジャパン アルデック・ジャパン
Henderson, NV, USA – July 19, 2021 – Aldec, Inc. (hereinafter "Aldec"), a pioneer in HDL mixed-language simulation and hardware-assisted verification for FPGA and ASIC, has released the ASIC/SoC physical prototyping/hardware emulation board "HES-VU19PD-ZU7EV," which supports designs of approximately 83M ASIC gates. Compared to boards of the same capacity, the HES-VU19PD-ZU7EV uses only two FPGAs for logic. This facilitates FPGA partitioning and reduces the time required to launch design projects targeting mid-sized ASICs or SoCs. Additionally, for large designs, it can achieve functionality equivalent to 332M ASIC gates by connecting four boards via a high-speed backplane (scheduled for release later this year). By interconnecting the backplanes (up to three), it is also possible to support designs of approximately 996M ASIC gates. Please refer to the attached document for more details.
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Press Release_HES-VU19PD-ZU7EV.pdf[682432]

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New HES Board Ideal for Prototyping and Emulation of Medium to Large Scale ASIC/SoC Designs
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HES-VU19PD-ZU7EV
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HES-XCVU9P-ZU7EV.png

HES prototyping board

Prototyping board equipped with multiple Xilinx UltraScale+, UltraScale, and Virtex-7.

The "HES-7" is an FPGA board equipped with multiple Xilinx UltraScale+, UltraScale, Virtex-7, and Zynq devices. We offer a variety of prototyping boards, including the "HES-UltraScale 440," which features FMC connectors for flexible expandability, and the "HES-UltraScale 1320," which supports up to 79 million ASIC gates. Additionally, we provide a fully automated and scalable hybrid verification environment for SoC/ASIC design called "HES-DVM." 【Features (HES-XCVU9P-ZU7EV)】 ■ Equipped with Xilinx Virtex UltraScale+ XCVU9P and Xilinx Zynq UltraScale+ XCZU7EV ■ Includes standard interfaces such as QSFP28, PCIe 3.0, and Gigabit Ethernet ■ Adopts FMC connectors for flexible expandability *For more details, please refer to the PDF document or feel free to contact us.

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HES-XCVU19PD-XCZU7EV_3.jpg

HES-VU19PD-ZU7EV

A prototyping board equipped with two of the largest Virtex UltraScale+ and one Zynq UltraScale+.

The HES-VU19PD-ZU7EV is a unique combination featuring two Virtex UltraScale+ VU19P FPGAs as logic modules and one Xilinx Zynq UltraScale+ ZU7EV MPSoC as a host module. It is equipped with a quad-core ARM Cortex-A53, a dual-core ARM Cortex-R5 real-time processing unit, an ARM Mali-400 MP2 GPU, an integrated H.264/H.265 video codec, and UltraScale+ programmable logic. This board targets high-speed physical prototyping and emulation for medium to large-scale ASIC designs. The HES-VU19PD-ZU7EV provides 83M ASIC gates and can reach up to 316M gates through the backplane. The board includes five SODIMM external memory slots, with four connected to the VU19P device and one to the ZU7EV device. The on-chip memory for the VU19P device is 166Mb, while the ZU7EV device has 11Mb.

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HES prototyping board

HES prototyping board

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HES-VU19PD-ZU7EV

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New Year's Greetings from IIDA Comprehensive Resin Processing

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Happy New Year! We have resumed operations today, January 6th (Tuesday). This year, we will continue to strive for quality improvement and enhanced services, aiming to be a company that satisfies everyone. We kindly ask for your continued support. We pray that this year will be bright and fruitful for all of you. 【Iida Manufacturing Co., Ltd. Fukushima No. 2 Factory】 〒969-1204 21-2 Mizukami, Nukazawa, Motomiya City, Fukushima Prefecture TEL: 0243-64-2320 FAX: 0243-64-2571

Jan 06, 2026

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New product! The "CEVO J-3400" is a blend wax developed by VOELPKER using montanic acid wax and various other waxes.

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VOELPKER is a Montan wax manufacturer with over 120 years of history in Germany, known for its long-standing achievements in Europe. 'CEVO' is a blend wax developed by VOELPKER, which has deep knowledge of Montanic acid wax, combining Montanic acid wax with various other waxes. This allows for applications that were not possible with conventional Montanic acid wax alone. 'CEVO' contributes to improvements in dispersibility, moldability, lubricity, and release properties. We offer part numbers tailored to different applications. This time, we introduced the general-purpose part number 'CEVO J-3400', but we also have other grades available, so please contact us if you are interested. 【Product Name】CEVO J-3400 【Main Functions】 For engineering plastics (materials: PS, ABS, PLA, PC, POM, PBT, etc.) ■ Lubricant ■ Improvement of dispersibility ■ Improvement of moldability ■ Improvement of release properties, etc. 【Overseas Usage Example】 Significantly improved mechanical properties (tensile modulus and tensile strength) by enhancing the dispersibility of carbon fibers in PC. *For more details, please refer to the PDF document or feel free to contact us.

Jan 06, 2026

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New Year SALE! From 1/6 to 1/20 (Tuesday), limited quantity! [Desk and Chair Set]

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A set of desk and chair is available for 8,800 yen (including tax), with a limited offer of 88 sets. Sales will end as soon as they are sold out. The desk has three drawers, and the chair comes with armrests and a hanger, making it a very practical product. Don't miss this opportunity!

Jan 06, 2026

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PFAS Regulation Countermeasures! ■■ Leak Test Equipment for Small Electronic Components|MSA-0101 series ■■ Does not use fluorinated inert fluids. PFAS-free. Offers accuracy equal to or better than liquid immersion testing.

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● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Jan 06, 2026

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Aluminum casting repair: Metal crack repair without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Jan 06, 2026

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