A new HES board ideal for prototyping and emulation of medium to large-scale ASIC/SoC designs.

Prototyping board equipped with multiple Xilinx UltraScale+, UltraScale, and Virtex-7.

The "HES-7" is an FPGA board equipped with multiple Xilinx UltraScale+, UltraScale, Virtex-7, and Zynq devices. We offer a variety of prototyping boards, including the "HES-UltraScale 440," which features FMC connectors for flexible expandability, and the "HES-UltraScale 1320," which supports up to 79 million ASIC gates. Additionally, we provide a fully automated and scalable hybrid verification environment for SoC/ASIC design called "HES-DVM." 【Features (HES-XCVU9P-ZU7EV)】 ■ Equipped with Xilinx Virtex UltraScale+ XCVU9P and Xilinx Zynq UltraScale+ XCZU7EV ■ Includes standard interfaces such as QSFP28, PCIe 3.0, and Gigabit Ethernet ■ Adopts FMC connectors for flexible expandability *For more details, please refer to the PDF document or feel free to contact us.

• Prototype Services
• Other information systems

A prototyping board equipped with two of the largest Virtex UltraScale+ and one Zynq UltraScale+.

The HES-VU19PD-ZU7EV is a unique combination featuring two Virtex UltraScale+ VU19P FPGAs as logic modules and one Xilinx Zynq UltraScale+ ZU7EV MPSoC as a host module. It is equipped with a quad-core ARM Cortex-A53, a dual-core ARM Cortex-R5 real-time processing unit, an ARM Mali-400 MP2 GPU, an integrated H.264/H.265 video codec, and UltraScale+ programmable logic. This board targets high-speed physical prototyping and emulation for medium to large-scale ASIC designs. The HES-VU19PD-ZU7EV provides 83M ASIC gates and can reach up to 316M gates through the backplane. The board includes five SODIMM external memory slots, with four connected to the VU19P device and one to the ZU7EV device. The on-chip memory for the VU19P device is 166Mb, while the ZU7EV device has 11Mb.

• ASIC

Features: ● Compatible with Intel Processor Core 3 and N series ● DDR5 SODIMM ×1 (up to 32GB) (sold separately) ● VGA ×1 + HDMI ×2 ● LAN ×4 (IEEE 802.3 at/af PoE compatible, total 80W) ● 9V–36V DC input (with protection circuit) ● Wide temperature range -20℃ to 60℃ ● Onboard TPM 2.0

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● Equipped with Intel Core Processor Series 2 ● Space-saving design of 150 × 270 × 225mm ● Supports ECC-compatible DDR5 memory ● Abundant storage configurations ● Dual 5G/4G communication expansion support ● Compatible with NVIDIA RTX PRO 4000 Blackwell SFF ● Flexible PCIe expansion ● Wide power input for industrial applications ● Operating temperature range of -20℃ to 45℃ ● Standard TPM 2.0 included * This model does not include memory, storage, or OS.

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

What is a leak test system specifically for small electronic components? It is a device used for leak testing small electronic components that require airtightness, such as crystal devices, ceramic oscillators, optical devices, power semiconductors, CAN devices, laser diodes, MEMS devices, SAW filters, small relays, and capacitors. Leak testing of sealed products requires two types of inspections: gross leak testing and fine leak testing. We offer fully automatic machines that can perform the entire process in one unit, as well as dedicated machines (custom-made) and convenient tabletop types for sampling inspections.