Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process.
In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements.
- Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure)
- High temperature compatibility ⇒ Mold temperatures up to 200°C
- Linearity (measurement error) ⇒ Less than 1% relative to the measurement range
- Resolution ⇒ 1/1,000 MPa
This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you!
April 20, 2022 (Wednesday)
April 27, 2022 (Wednesday)
May 11, 2022 (Wednesday)
May 18, 2022 (Wednesday)
Please check the details and register using the registration form.
https://info.kistler.com/ja-webinar-semicon
We look forward to many participants joining us.

| Date and time | Wednesday, Apr 20, 2022 10:30 AM ~ 11:20 AM |
|---|---|
| Capital | Online |
| Entry fee | Free |
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