Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for the inside of molds" and IoT technology (May 11)

Pressure sensors supporting the internal pressure monitoring systems spreading in the home appliance industry.

Our in-mold pressure sensor, which has primarily been used for measuring and monitoring in-mold pressure of automotive-related molded parts, along with our monitoring system "ComoNeo," is now also being adopted in the home appliance industry. Efforts to improve productivity through in-mold pressure monitoring of products such as air conditioners and washing machines are expanding. The 6182D series in-mold pressure sensor measures in-mold pressure for plastic injection molding up to 2,000 bar, making it suitable for various molded products. Additionally, using the monitoring system "ComoNeo" allows for the quantification of the molding process. (Please refer to the catalog below for more information on "ComoNeo.") Currently, we are also accepting applications for online meetings. If you are interested, please feel free to contact us via the inquiry button. 【Features】 • Uses single wire cable • No diaphragm, allowing for tip processing (standard type) • Tip coating (optional) • Cable replacement available

• Pressure

The 6157C series internal pressure sensors are best-selling products used worldwide.

The crystal piezoelectric sensor 6157C series measures the in-mold pressure of plastic injection molding up to a maximum of 2.00 bar. Since there is no diaphragm at the tip, it can be processed up to 0.5 mm to match the shape of the mold's inner surface, and the connection cable is replaceable.

• Other molds
• Pressure

An innovative user interface combined with a capacitive multi-touch monitor achieves top-class efficiency and ease of use!

The Kissler ComoNeo is a process monitoring system designed to optimize, monitor, and document the plastic injection molding process. In addition to mold cavity pressure, it collects and evaluates signals from the injection molding machine (e.g., injection pressure, injection speed, screw position, etc.) as well as the mold surface temperature (connected via thermocouple temperature amplifier model 2205A...). －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • A "dashboard" screen displays relevant processing data consolidated into one screen. • The "EO Assistant" software allows for automatic creation and definition of monitoring boxes. • Simple and efficient hardware and software design due to a process-oriented operational concept. • Rapid mold changes and short setup times are possible with the automatic mold identification feature. • The built-in cycle history (data memory) can store up to 50,000 cycles. • Key process parameters necessary for monitoring and evaluating process stability are automatically calculated.

• Other processing machines
• Other measurement, recording and measuring instruments
• Other process controls

A tip diameter of Φ1mm, simultaneously measuring resin pressure and mold surface temperature!

The p-T sensor 6188AA series for measuring internal pressure and mold surface temperature can simultaneously measure resin pressure up to 2,000 bar and mold surface temperature in plastic injection molding.

• Other temperature and humidity measuring instruments
• Pressure

Ideal for low-viscosity plastics and resins!

The in-mold pressure sensor 6161AA measures in-mold pressure during plastic injection molding up to a maximum of 200 bar. It is suitable for low-viscosity plastics and resins. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Ideal for industrial applications such as high-pressure RTM molding • Structure with a diaphragm • Seals the gap between the mounting hole and the sensor using an O-ring • Integrated screw-type structure • Cable is replaceable

• Pressure

Connect to the process monitoring system ComoNeo with a single cable! Space-saving! Reduced mold installation time!

This is a connector for connecting up to 8 single wires or coaxial cables to ComoNeo using a single cable. The 4-channel connector connects up to 4 sensors, while the 8-channel connector can connect up to 8 sensors. • Up to 8 internal pressure sensors can be used • Multi-connector for 4-channel or 8-channel • Use of extension cables for 4-channel or 8-channel

• Other measurement, recording and measuring instruments

Ideal for low-viscosity plastics and resins!

The in-mold pressure sensor 6163A measures in-mold pressure during plastic injection molding up to a maximum of 1,000 bar. It is suitable for low-viscosity plastics and resins. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Ideal for industrial applications such as high-pressure RTM, LSR, and SMC • Structure with a diaphragm • Cable is replaceable

• Pressure

Ideal for low-viscosity plastics and resins!

The in-mold pressure sensor 6162AA measures in-mold pressure during plastic injection molding up to a maximum of 200 bar. It is suitable for low-viscosity plastics and resins. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Ideal for industrial applications such as high-pressure RTM, LSR, and SMC • Structure with a diaphragm • Cable is replaceable

• Pressure

High-sensitivity compact sensor with a tip diameter of Φ2.5mm!

The 6178A series in-mold pressure sensor measures in-mold pressure during plastic injection molding up to a maximum of 200 bar. Since there is no diaphragm at the tip, it can be processed up to 0.5 mm to match the shape of the mold's inner surface.

• Pressure

Tip diameter Φ4mm, simultaneously measuring resin pressure and mold surface temperature!

The 6190CA series internal pressure and mold surface temperature measurement sensor (p-T sensor) can simultaneously measure resin pressure up to 2,000 bar and mold surface temperature in plastic injection molding.

• Pressure

A tip diameter of Φ2.5mm, simultaneously measuring resin pressure and mold surface temperature!

The 6189A series internal pressure and mold surface temperature measurement sensor (p-T sensor) can simultaneously measure resin pressure up to 2,000 bar and mold surface temperature in plastic injection molding.

• Pressure

Compact sensor with a tip diameter of Φ1.2mm!

The 6184A series in-mold pressure sensor measures in-mold pressure for plastic injection molding up to 2,000 bar. Since there is no diaphragm at the tip, it can be machined up to a maximum of 0.3mm to fit the shape of the mold's inner surface. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Capable of measuring up to 2,000 bar • Machining at the tip is possible due to the absence of a diaphragm

• Pressure

Compact sensor with a tip diameter of Φ1mm!

The 6183C series in-mold pressure sensor measures in-mold pressure during plastic injection molding up to 2,000 bar. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Uses single-wire cable • Capable of tip processing due to the absence of a diaphragm (standard type) • Tip coating (optional) • Replaceable cable

• Pressure

A robust structure without a diaphragm, capable of accommodating a wide measurement range!

The 6152A series crystal piezoelectric type internal pressure sensor measures the internal pressure of plastic injection molding up to a maximum of 2,000 bar. Since there is no diaphragm at the tip, it can be machined up to 0.5mm to fit the shape of the mold's inner surface. The connection cable is replaceable. －＊ Features ＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－＊－ • Ideal for industrial use • Machining at the tip is possible up to 0.5mm (except for tip-coated types) • Replaceable cable

• Pressure
• Other measurement, recording and measuring instruments

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session

[Lecturers] Accenture Ltd. Business Consulting Division Strategy Group, Technology Strategy Senior Manager Mamoru Yoneshige Accenture Ltd. Technology Consulting Division CDAI Consulting Principal Director Hiromichi Sugiyama [Key Lecture Content] While system development using AI agents is gaining attention, the challenges of AI-driven development in brownfield projects for enterprises with existing assets and technical debt are significantly greater. The introduction of coding support tools alone does not lead to company-wide transformation, and there exists a structural gap between the success of Proof of Concept (PoC) and the success of company-wide deployment. In this lecture, based on practical insights from Accenture's comprehensive support from strategy formulation to implementation, we will systematically explain the essentials for successful company-wide deployment, including the six principles of AI-driven development, categorization of brownfield types and deployment strategies, context engineering, the systematization of methodologies such as harness engineering and specification-driven approaches, promotion systems and in-house production strategies, and KPI design as a management agenda.