Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for the inside of molds" and IoT technology (May 11)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is a growing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process.
In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements.
- Low-viscosity resin compatibility ⇒ Structure that does not produce measurement errors due to epoxy resin intrusion (diaphragm structure)
- High-temperature compatibility ⇒ Mold temperatures up to 200°C
- Linearity (measurement error) ⇒ Less than 1% against the measurement range
- Resolution ⇒ 1/1,000 MPa
This webinar will be held twice on the following dates, but the content will be the same for both sessions, so please feel free to join on the date that is most convenient for you!
May 11, 2022 (Wednesday)
May 18, 2022 (Wednesday)
Please check the details and register via the registration form.
https://info.kistler.com/ja-webinar-semicon
We look forward to many participants joining us.

| Date and time | Wednesday, May 11, 2022 10:30 AM ~ 11:20 AM |
|---|---|
| Capital | Online |
| Entry fee | Free |
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