Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions Inside Molds" and IoT Technology (5/18)
In the semiconductor industry, especially in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process.
In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements.
- Compatible with low-viscosity resins ⇒ Structure that does not produce measurement errors due to resin intrusion (diaphragm structure)
- High-temperature compatibility ⇒ Mold temperatures up to 200°C
- Linearity (measurement error) ⇒ Less than 1% for the measurement range
- Resolution ⇒ 1/1,000 MPa
May 18, 2022 (Wednesday)
Please check the details and register using the registration form.
https://info.kistler.com/ja-webinar-semicon
We look forward to the participation of many people.

| Date and time | Wednesday, May 18, 2022 10:30 AM ~ 11:20 AM |
|---|---|
| Capital | Online |
| Entry fee | Free |
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