Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process.
In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements.
- Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure)
- High-temperature compatibility ⇒ Mold temperatures up to 200°C
- Linearity (measurement error) ⇒ Less than 1% relative to the measurement range
- Resolution ⇒ 1/1,000 MPa
This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you!
April 27, 2022 (Wednesday)
May 11, 2022 (Wednesday)
May 18, 2022 (Wednesday)
Please check the details and register using the registration form.
https://info.kistler.com/ja-webinar-semicon
We look forward to many participants joining us.

| Date and time | Wednesday, Apr 27, 2022 10:30 AM ~ 11:20 AM |
|---|---|
| Capital | Online |
| Entry fee | Free |
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