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  5. Other semiconductor manufacturing equipment
  6. VBPC(Vertical Bending Probe Card)

VBPC(Vertical Bending Probe Card)

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VBPC

last updated:Oct 01, 2010

コーヨーテクノス
コーヨーテクノス
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VBPC(Vertical Bending Probe Card)

Utilizing the deflection caused by the vertical stroke of the wire as contact load, this is a fixture for substrate inspection. The "VBPC" is a probe made from ultra-fine wires such as tungsten, which have been specially plated and coated with Teflon, and it uses the deflection from the vertical stroke of the wire for contact load in substrate inspection. 【Features】 ◆ Tip plate material: Engineering plastic / Ceramic ◆ Pin position accuracy: ±5 ◆ Pin height variation: ±10 ◆ Pin tip shape: Round / Needle / Flat ■□■□■□■□■□■□■□■□■□■□■□■□ ===== Please contact us for more details=====

    Other semiconductor manufacturing equipment
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VBPC(Vertical Bending Probe Card)

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vbpc.jpg

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basic information

Utilizing the deflection caused by the vertical stroke of the wire as contact load, this is a fixture for substrate inspection. The "VBPC" is a probe made from ultra-fine wires such as tungsten, which are specially plated and coated with Teflon, and it uses the deflection from the vertical stroke of the wire as contact load for substrate inspection. 【Features】 ◆ Tip plate material: Engineering plastic / Ceramic ◆ Pin position accuracy: ±5 ◆ Pin height variation: ±10 ◆ Pin tip shape: Round / Needle / Flat ■□■□■□■□■□■□■□■□■□■□■□■□ ===== For more details, please contact us=====

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Applications/Examples of results

【Usage】 In addition to inspecting bare boards, it excels in narrow pitch applications and is widely used for package substrates, TAB, COF substrates, four-terminal measurement fixtures, and semiconductor inspections.

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コーヨーテクノス

コーヨーテクノス

Testing, Analysis and Measurement

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Koyo Technos has been engaged in the manufacturing of inspection fixtures for printed circuit boards, semiconductor packages, and other advanced inspection devices, which can be considered the heart of cutting-edge inspection equipment, since its establishment. As market demands for multifunctionality, high density, high performance, and ultra-compactness continue to rise, our product lineup, backed by advanced technology, consistently receives unwavering recognition in all advanced fields. Our consistent theme is to accurately respond to user demands with foresight that captures the trends of the times. This micron-level precision technology, which does not allow competitors to catch up, has generated strong trust in the market.

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