Flip chip assembly contract service
We offer a contract assembly service specialized in flip chip assembly that can achieve high-density implementation at low cost. We support prototype flip chip assembly from rigid substrates to COF, COG substrates, and Si interposer substrates, as well as 3D assembly prototypes using TSV electrodes.
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basic information
What is flip chip mounting? Flip chip mounting is a method of connecting the bump (metal protrusions such as Au, solder, Cu, etc.) formed on the electrode pads of a bare chip to the pad area of a mounting substrate by flipping the chip over. Compared to the traditional wire bonding method, which connects the surface pad of the chip to the substrate using wires (such as Au, Al, etc.), the flip chip method eliminates the need for wires, resulting in superior electrical characteristics. This makes it suitable for high-frequency circuits and allows for a reduction in mounting area, making it ideal for mobile device applications. Additionally, its ability to easily transfer heat to the substrate makes it useful for high-power LED (light-emitting diode) mounting, where heat generation significantly impacts chip performance.
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Applications/Examples of results
【Main Applications】 □ Driver ICs for LCD panels (COG substrates, COF substrates) □ High-power LEDs (Si substrates, ceramic substrates, metal substrates) □ Image sensors □ SiP packages (system modules for mobile device products) □ COC (Chip-on-Chip) 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Product Information http://well-jisso.jp/ Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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