We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
We provide total solution services from circuit design necessary for flip chips, bump and re-routing processing, wafer back grinding and dicing, flip chip mounting, to reliability joint evaluation, as well as sales of next-generation flip chip mounting machines.
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Main Services - COF/COG substrate circuit design to small-scale prototyping - Bump processing (Au, solder, Cu) - Rewiring processing (L/S: 10μm) - BG/dicing processing (wafer thickness: 30μm, wafer size: up to 12 inches) - Assembly prototyping (COF, COG, SiP, CoC, C4, etc.) - Reliability and bonding evaluation - Sale of ultrasonic flip chip bonders (for research and development & small-scale production applications)
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Applications/Examples of results
1) Implementation Methods - Heat press bonding, ultrasonic joining 2) Compatible Chip Sizes From 0.5mm 3) Compatible Substrates Rigid substrates, COG substrates, COF substrates, silicon substrates 4) Other Assembly Processes and Inspection Processes - Plasma cleaning - Flux application - X-ray observation (void observation at joints) - Infrared microscope (for cracks on the back of chips) - Ultrasonic flaw detection (void observation at joints) 5) Joint Reliability Evaluation - High temperature and high humidity bias test - Temperature cycling test - Moisture absorption reflow test - Thermal resistance measurement (heat dissipation characteristic test) 【Contact Information】 Phone: 03-5715-3501 E-Mail: info@welljp.co.jp Company Information http://www.welljp.co.jp/
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
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