High aspect ratio through-hole micro machining
For delicate and difficult-to-process silicon wafers, laser processing can be done stress-free. In this example, high-aspect perforation processing was performed on a standard wafer of 0.6 mm thickness using THG-YAG.
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basic information
For delicate and difficult-to-process silicon wafers, stress-free processing can be achieved with lasers. In this example, high-aspect perforation processing was performed on a standard wafer of 0.6 mm thickness using THG-YAG.
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Applications/Examples of results
Material: Silicon wafer Thickness: 650 μm Diameter: 80 μm
Company information
At Lips Works Co., Ltd., we provide contract micro-fine processing using ultra-short pulse lasers, as well as the design and manufacturing of laser systems. In our contract processing business, we have been quick to engage in the development of industrial ultra-short pulse lasers and have been involved in contract micro-fine processing using these lasers. We specialize in applying fine periodic structures (microtextures) to work surfaces aimed at controlling tribological properties, optical properties, and release/adhesion characteristics. We can accommodate requests from small-scale prototypes to mass production according to our customers' needs. In our system engineering business, we leverage the laser processing technology cultivated in our job shop to provide a comprehensive service from selecting laser oscillators suitable for applications, designing optical systems, devising fixtures and auxiliary equipment, to system integration. We assist in improving the precision and efficiency of the processing required by our customers. As experts in laser technology providing cutting-edge laser processing techniques, we strive to be a valuable resource for our customers, so please feel free to contact us.
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