Over the past 30 years, there has been a proven track record of being installed in numerous semiconductor wire bonders.
In recent years, the demands for ultrasonic bonding with various materials and fine pitch bonding have become complex and diversified. We provide reliable solutions for all of these needs. 【Features】 We offer a variety of types. ○ ST Type Transducer Standard ultrasonic transducer for pole bonders ○ ST-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ B Type Transducer Latest ultrasonic transducer for pole bonders ○ PT Type Transducer Standard ultrasonic transducer for wedge bonders ○ PT-LE Type Transducer Ultrasonic transducer enabling fine pitch wire bonding ○ W Type Transducer Latest ultrasonic transducer for wedge bonders ● For more details, please contact us or download the catalog.
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Applications/Examples of results
Wire bonder, flip chip. Ultrasonic bonding transducer for bonding equipment.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.