Thorough pursuit of compactness and lightweight design.
It is developed targeting chip sizes from 0.15mm to 5mm. 【Features】 - The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. - Capable of accommodating various chip sizes without replacing the transducer. - Frequency: 60kHz - Option: Cartridge heater For more details, please contact us or download the catalog.
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basic information
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Price information
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Delivery Time
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Applications/Examples of results
Automatic flip chip devices from various companies, as well as manual/semi-automatic flip chip devices for research and development.
catalog（1）
Download All Catalogs![[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.](https://image.mono.ipros.com/public/catalog/image_generated/01/d75/364145/364145_IPROS6167932514340624170_1.jpg?w=120&h=170)
Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.