Thorough pursuit of compactness and lightweight design.
It is developed targeting chip sizes from □3mm to □10mm. 【Features】 ○ The tip of the ultrasonic transducer is designed to allow for the attachment of a collet. ○ Capable of accommodating various chip sizes without replacing the transducer. ○ Frequency: 60kHz ○ Option: Cartridge heater ● For more details, please contact us or download the catalog.
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basic information
For more details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
For multi-pin / large chip applications
catalog（1）
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.