Equipped with "constant power mode" and "constant voltage mode."
It is designed to monitor the impedance value fluctuations during bonding and automatically achieve stable ultrasonic output. 【Features】 ○ Always capable of selecting optimal conditions for bonding applications ○ Functions such as "RAMP," "DELAY," and "BOOST" can be utilized ○ Stable bonding is possible even for materials prone to cracking and chipping ○ Ultrasonic output: up to 2.5W ○ Control method: voltage control, power control (power equalization) ○ Frequency: standard products 58–64kHz, high-frequency products 80–130kHz ○ Weekly control: automatic impedance tracking type ○ Interface: 8-bit parallel, Trigger I/F, RS-232C ○ External display: impedance value, oscillation frequency, oscillation output level phase difference ○ Input power supply: 100–240V AC 50/60Hz (multi-voltage compatible) ● For more details, please contact us or download the catalog.
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.