Plastic processed products - Semiconductor manufacturing equipment parts made of polyimide resin.
Heat-resistant polyimide resin MELDIN has been adopted for the wafer carriers of semiconductor manufacturing equipment.
To improve the durability of components used in harsh environments, polyimide resin MELDIN has been adopted as an alternative to quartz.
Inquire About This Product
basic information
Material MELDIN 7001 Polyimide resin, natural grade The MELDIN 7000 series is an all-aromatic polyimide resin that maintains excellent mechanical properties from low to high temperatures, with outstanding heat resistance that allows for use at 482°C for short periods. It also excels in wear resistance, creep resistance, and electrical insulation. Reasons for adoption Heat resistance: approximately 270°C Plasma resistance Prevention of carrier chipping and damage
Price information
The price varies depending on the quantity, so please feel free to contact us.
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
During the transport or processing of silicon wafers, polyimide resin MELDIN has been adopted for the cassette that holds and stores the wafers.
Company information
Since its establishment in 1937, our company has been engaged in ultra-precision microfabrication, mechanical cutting, welding, fusion processing, three-dimensional processing, wrapping, and polishing of high-performance resin materials known as super engineering plastics, including PEEK resin and polyimide resin (Meldin), for over 80 years. In 2010, we introduced 3D printers along with the latest 3D data creation software and 3D/CT scanners, beginning our proposals for advanced 3D manufacturing. In all aspects of manufacturing, our company has selected and utilized equipment and software from the manufacturer's perspective, independent of any specific device or software manufacturer. We ensure high-precision manufacturing to gain absolute trust in our products, while also prioritizing the intended use in 3D data, providing 3D data that meets our customers' objectives.
![[For Small and Medium Enterprises!] Methods of Fundraising Part 2](https://image.mono.ipros.com/public/product/image/7eb/2001516763/IPROS9790476298316651679.jpg?w=280&h=280)
![[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280)
