Adhesives and Release Agents: Basics, Coating, Evaluation, and Applications - Adhesives for Touch Panels
S11022
★Moisture and heat white-out resistance, blister resistance, step-following ability...! Control the design of OCA (optical adhesive) and the required characteristics demanded in the market!
Lecturer Shinya Ichikawa, Ph.D. R&D Division, Technology Headquarters, Lintec Corporation Target Audience: Engineers, researchers, and beginners interested in optical adhesives and electronic component release films Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 1 [Tokyo, Nihonbashi] 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3), among others Date and Time: October 25, 2011 (Tuesday) 13:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, includes lunch and text costs) for up to 2 participants from one company *Limited to Tech-Zone members who apply by October 11. Membership registration is free. *After October 11, the [Regular Price] will be 49,350 yen (tax included, includes text costs) for up to 2 participants from one company. ◆If 3 participants from the same organization apply, the fee will be 69,300 yen.
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basic information
**Lecture Summary** In recent years, adhesive tapes have gained attention as high-performance, multifunctional materials, and the improvement of technological capabilities based on the fundamentals of adhesives has led to the development of new markets. Among these, the growth of adhesives used in the electronics field is particularly notable in mobile phone and touch panel applications, making the development of new adhesive tapes essential for these new product developments. Consequently, release materials that serve the protective function of adhesive tapes have become indispensable and are responding to market needs as release materials for electronic component manufacturing. This lecture will discuss the fundamentals of adhesives and release agents, as well as coating and evaluation methods, and will introduce the technological trends of optical adhesives and films used in electronic component manufacturing processes.
Price range
P2
Delivery Time
P2
Applications/Examples of results
1. Basics of Adhesives 2. Evaluation of Adhesive Properties 2-1 Adhesive Strength 2-2 Holding Power and Cohesive Strength 2-3 Tack 2-4 Other Testing Methods 3. Optical Adhesives 3-1 Required Properties of Adhesives for Polarizing Films 3-1-1 Heat Resistance and Moisture-Heat Resistance 3-1-2 Mechanism of Light Leakage and Suppression Methods 3-2 Required Properties of Adhesives for Touch Panels 3-2-1 Adhesive Characteristics for Difficult-to-Bond Materials 3-2-1 Moisture-Heat Whitening Resistance and Blister Resistance 3-2-2 Step Followability 4. Basics of Release Agents 4-1 Classification and Characteristics of Release Agents 4-2 About Silicone 4-3 Required Properties and Evaluation Methods of Release Agents 4-4 Coating Methods 4-5 Other Release Agents 5. Release Paper and Release Film 5-1 Types and Characteristics 5-2 Surface Properties of Films 5-3 Applications 6. Films for Electronic Component Manufacturing 6-1 What is a Multilayer Ceramic Capacitor (MLCC)? 6-2 Market Trends of MLCC 6-3 Required Properties of Release Films for MLCC Manufacturing
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