Nitrogen purge compatible with high temperatures (600°C). Ideal for heating processes that require oxidation prevention.
The high-temperature nitrogen purge hot plate "PH-212-600" is designed for high-temperature (600℃) nitrogen purge applications with a high-temperature heater specification. It supports a wide range of applications such as die bonding and soldering (production, prototyping, evaluation, analysis, etc.). The chamber structure and gas ejection patterns can be customized according to the work and application. For more details, please download the catalog.
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basic information
**Features** - Supports nitrogen purge at high temperatures (600°C) - High-temperature heater specification - Compatible with a wide range of applications such as die bonding, soldering, etc. (production, prototyping, evaluation, analysis, etc.) - Chamber structure and gas ejection patterns can be customized according to the workpiece and application - Programmable temperature controller (sold separately) allows for temperature program settings - Temperature range: 50-600°C, heating rate: 50°C/min (max 90°C/min) For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Soldering preheating ○ Chip components ○ Die bonding process ○ Heating processes that require various gas atmospheres (limited to inert gases) ○ Heating processes that require oxidation prevention functions, such as material evaluation, device evaluation, and eutectic die bonding ● For more details, please contact us or download the catalog.
catalog（1）
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Company information
We invite production engineers and manufacturing staff to visit the MSA Factory website, which provides strong support!
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