It has a structure that prevents two layers from overlapping!
This is a device that uses a special underwater suction head to feed silicon wafers stacked together, with a thickness of 140μm to 200μm, one by one using upper and lower feeding rollers, and stores them in a wafer carrier after rough cleaning.
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basic information
Device dimensions Size: W1100XD3550XH1500 Works: Silicon wafers for solar cells after rough cleaning 156±0.5mm, 156.5±0.5mm, 125±0.5mm, 126±0.5mm Thickness 140μm to 200μm
Price information
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Price range
P7
Delivery Time
※After receiving the order
Applications/Examples of results
This is a device that is installed in the next process of the rough cleaning of solar cell silicon wafers, which automatically separates the stacked wafers into single sheets in water after rough cleaning and stores them in carriers via conveyor transport. It is also capable of automatic transport to the loader section of the finishing cleaning device as an additional specification.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.