Supports a maximum temperature of 300℃! Hot plate for small wafers and glass substrates.
The Heating Process Wafer Hot Chuck PH070 is a hot plate designed for small wafers and glass substrates. It uniformly heats extremely thin workpieces such as wafers and glass substrates. The workpieces are fixed in place by vacuum suction, which prevents stress from being applied to them. The plate is made of aluminum alloy, treated with black anodizing, features guide markings through laser marking, and allows for precise temperature control with an MSA digital temperature controller. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Supports maximum temperature of 300℃ ○ Hot plate for small wafers and glass substrates ○ Wafer hot chuck and hot stage ○ Suitable for pre-process, assembly process, and evaluation/analysis processes ○ Can be added to existing stages and more ○ Wafer (substrate) size 50~70mm ○ Various temperature ranges and mechanical interfaces available ○ OEM compatible products ○ Wide range of options including pressure gauges and vacuum switching valves 【Specifications】 ○ Temperature control range: Room temperature to 300℃ ○ Chuck surface size: 70×70mm ○ Temperature accuracy: ±1.5% ● For more details, please contact us or refer to the catalog.
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