High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.
At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. We offer a lineup that includes "high heat dissipation metal printed circuit boards," "high brightness and high heat dissipation reflector printed circuit boards," "high heat dissipation multilayer printed circuit boards," and "high heat dissipation thick copper printed circuit boards." [Required Technical Elements] - We propose high-reflective solder resist and reflector processing techniques to achieve high brightness. - We offer high reflection rate Au and Ag plating techniques unique to companies that have emerged from plating. - For heat dissipation technology, we propose heat dissipation CEM3 and heat dissipation FR4 starting from metal printed circuit boards. For more details, please contact us or download the catalog.
Inquire About This Product
basic information
【Lineup and Features】 [High Heat Dissipation Metal Printed Circuit Board] ○ High Reflective Plating → High reflective electrolytic wire bonding Au plating, as well as electroless wire bonding Au and Ag plating are also possible. ○ Heat Dissipation Substrate → Aluminum and copper suitable for heat dissipation of bare chips. → Thermal conductivity of the insulating layer is 1.0W to 3.1W/m·k. [High Heat Dissipation Multilayer Printed Circuit Board] ○ High Reflective Solder Resist → Reduces yellowing and maintains high reflectivity. ○ Heat Dissipation Design → Circuit design that quickly transfers heat from the device to the backside. ○ Heat Dissipation and Through-Hole Substrate. [High Brightness and High Heat Dissipation Reflector Printed Circuit Board] ○ High Reflective Plating. ○ High Brightness Reflector Processing → Reflects light from bare chips to enhance brightness. ○ Heat Dissipation and Through-Hole Substrate → A heat dissipation printed circuit board that can form through-holes, improving design flexibility. → The thermal conductivity of the insulating layer, which excels in heat dissipation, is 1.3W/m·k. [High Heat Dissipation Thick Copper Printed Circuit Board] ○ High Heat Dissipation Thick Copper Pattern → Quickly dissipates heat generated by the device through thick copper. ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or download the catalog.
catalog（1）
Download All Catalogs
Company information
Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.
