It is possible to minimize contact with the wafer by adopting an edge grip method.
The 300mm compatible edge grip aligner SAL20C1 series is designed for transport that requires positioning of wafers in semiconductor manufacturing equipment and inspection devices. By adopting the edge grip method, it minimizes contact with the wafer. After notch searching, a repositioning operation is included to move the notch to the specified position. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Supports transportation requiring wafer positioning in semiconductor manufacturing equipment and inspection devices. ○ Adopts edge grip method. → Minimizes contact with the wafer. → Enables high-speed and high-precision positioning of silicon wafer centering and notches. ○ Designed to reduce contamination from friction and sliding. ○ Control method: RS232C and parallel photo I/O. 【Specifications】 ○ Transported item: 300mm silicon wafer. ○ Positioning time: Notch search: 2.5 sec (without re-gripping). ○ Positioning accuracy: Centering: within ±0.3mm; Notch locating: within ±0.1 degrees. ○ Sensor: Transmissive LED sensor. ○ Cleanliness: 0.1μm Class 1 (during exhaust of drive section). ○ Drive method: Uses 2-phase stepping motors on 2 axes; motor driver and controller are built-in. ○ Utility: Power supply: DC24V 2A. ● For more details, please contact us or refer to the catalog.
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