Inspection of BGA and QFP mounted boards, and narrow pitch connector introduction boards at the pin level.
The feature of boundary scan testing with JTAG is that by ensuring the quality of the BGA section through functional testing, the overall inspection time of the product increases, which in turn allows for reliable assurance of BGA implementation and enables the identification of defects in a short time at the pin level.
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basic information
When there are many BGA and QFP components, it is generally difficult to set up enough test pins, so functional testing is commonly performed. However, it is challenging to adequately identify the root causes of defects, so the introduction of CORELIS's boundary scan testing allows for the identification of defective areas at the pin level.
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Inspection of BGA/QFP mounted boards
Company information
The electronics industry is experiencing fierce developments towards speed, cost performance, communication, labor saving, originality, and the creation of new value. We are committed to contributing to the improvement of product completeness by resonating with our customers on the front lines, through proposals for various board inspection equipment, the development of function testers, and the development and manufacturing of various jigs (fixtures).
