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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Semiconductor inspection/test equipment
  6. 12-inch wafer compatible bump tester SigmaW12

12-inch wafer compatible bump tester SigmaW12

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Sigma W12

last updated:Oct 29, 2024

テクノアルファ
テクノアルファ
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Share of bumps on a maximum 12-inch wafer, the best bond tester for tweezer pull tests.

A multifunctional bond tester ideal for bump shear tests and tweezer pull tests on wafers up to 12 inches. The rotating measurement head eliminates the need for operators to change sensors (load cells). With a stage movement speed of up to 50 mm/sec, a wide range of bumps can be measured in a short time. The rotating shear sensor eliminates the need for wafer rotation. Automation is achieved through an automatic measurement program compatible with pattern recognition. An optional blower and vacuum cleaner can remove residue from the tool tip. A full-auto specification proposal including a wafer transport system is also available.

    Semiconductor inspection/test equipment
Condor-Sigma-W12-automated-big.png

12-inch wafer compatible bump tester SigmaW12

Condor-Sigma-W12-automated-big.png
Condor-Sigma-W12-automated-big.png wafer chuck.JPG Sigma-wafer-handler-Rorze-big.jpg Debris-Cleaning-After-Test.png cleaner.JPG
  • Related Link - http://www.technoalpha.co.jp/products/semiconducto…
  • Special site - Product/service details - https://pr.mono.ipros.com/technoalpha/product/

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basic information

The latest model Sigma from Dutch company XYZTEC is a dedicated machine for 8-inch and 12-inch wafers. With a movable range of 500mm on the X-axis and 370mm on the Y-axis, it can measure the entire area of a 12-inch wafer. It supports wide-range measurements with a stage movement speed of up to 50mm/sec, ensuring stress-free operation. High-magnification offset cameras allow for observation and image recording of fracture surfaces. The automatic measurement function with pattern recognition significantly reduces labor in measurement tasks and eliminates variability caused by operators. It is equipped with a high-precision sensor (load cell) with an error of ±0.075%. The rotary head can accommodate up to six sensors, eliminating the need for operators to switch sensors during share and pull transitions. The fully automatic model compatible with EFEM specifications has been adopted by major semiconductor manufacturers overseas.

Price information

Prices vary depending on specifications. Please contact us for more details.

Delivery Time

Please contact us for details

※6 to 12 months (varies by specifications)

Applications/Examples of results

Share test of solder bumps on the wafer, tweezer pull test, share test of gold bumps.

Company information

テクノアルファ

テクノアルファ

Electronic Components and Semiconductors

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Our mission at Techno Alpha is to "shine a light on Japanese manufacturing" by creating overwhelming added value. To achieve this, we have set our vision as "the best technology trading company in Japan" and are committed to realizing it. Techno Alpha is a team composed of members with technical backgrounds, including sales, service, mechanical design, electrical design, and software development. Our strength lies in our ability to solve problems from the same perspective and in the same language as our customers, enabling us to provide rapid access to the latest technologies. In this team, we strive to discover cutting-edge technologies from around the world, introduce them domestically, and develop what does not yet exist in the market ourselves. By quickly uncovering the world's leading technologies and developing what is not available, we can support the entire manufacturing industry in Japan. Our team upholds the value of "connecting with the world, honing our technology, and challenging the future," and we will continue to refine our ability to discover products, design and develop, and provide technical services, all in pursuit of creating overwhelming added value that will impress our customers.

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