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  4. Semiconductor Manufacturing Equipment
  5. Bonding Equipment
  6. Tabletop ACF Hot Pressing Device BD-01

Tabletop ACF Hot Pressing Device BD-01

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BD-01

last updated:Oct 08, 2014

大橋製作所 機器事業部
大橋製作所 機器事業部
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ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.

Despite being a space-saving manual machine, it has a proven track record from research and development to mass production applications. It supports a wide range of work including FPC, IC, LCD, and PWB.

    Bonding Equipment
BD-01.jpg

Tabletop ACF Hot Pressing Device BD-01

BD-01.jpg
BD-01.jpg
  • Related Link - http://www.ohashi-engineering.co.jp/products_press…

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basic information

This is a tabletop manual machine for thermally bonding one part of a workpiece. The workpiece is suction-fixed to the stage, and after moving forward to the bonding position, the head descends to perform the thermal bonding. [Specifications excerpt] - Stage size: Max. 180(W) x 100(D) mm - Head size: Max. 60(W) x 5(D) mm - Heating method: Constant heat - Cushioning material: Automatic winding Teflon sheet

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Applications/Examples of results

Corresponding to the following processes: FOB/FOG/FOF/COB/COG/COF

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Tabletop ACF Hot Pressing Device BD-01

Tabletop ACF Hot Pressing Device BD-01

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大橋製作所

大橋製作所 機器事業部

Industrial Machinery

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Since our founding, we have been comprehensively developing the design, manufacturing, and sales of microelectronics assembly equipment using precision sheet metal processing and ACF bonding technology. Since we began to commercialize the know-how cultivated in sheet metal processing as a tool for improving quality and productivity, we have consistently pursued business diversification and management independence through differentiated technologies. In the field of sheet metal processing, we are capable of vertical integration from product design and development to the assembly of finished products, not just contract processing, providing OEM and ODM (Original Design Manufacturing) products to our client companies. In the area of ACF bonding assembly machines, supported by the rapid development of the FPD industry, our products are adopted by many customers both domestically and internationally. In 1999, our tabletop COG assembly machine, which overturned industry norms, received the annual excellence award from the Nikkei newspaper. We take pride in the fact that the emergence of this tabletop machine has broadened the industry from being the domain of a few large companies to include many small and medium-sized enterprises. We have successfully developed the world's first "full-auto FOB line," and along with our manual tabletop machines and standalone semi-auto machines, we have evolved into a full-line manufacturer of ACF bonding assembly machines.

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