One oscillator can simultaneously provide ultrasonic vibrations to four sieves! No clogging or bridging. *Please inquire about test or rental units.
This is an ultrasonic sieve device that can apply ultrasonic vibrations to up to four sieves with a single oscillator. It allows for simultaneous classification of four sieves in one operation, enabling efficient experiments. The need for four oscillators has been reduced to just one, resulting in cost savings for equipment. 【Features】 ■ Ultrasonic classification and sieving device: Prevents clogging and dramatically improves sieving capability. ■ Powder issues! Clogging, adhesion, bridging, lifespan, and capacity increases are resolved with ultrasound! ■ Easy attachment of ultrasonic vibrations to SUS mesh with a clamp fixture for standard laboratory sieve frames of sizes φ75, φ100, φ150, φ200, φ300, etc. ■ A new type of clamp fixture allows for vibration application to two layers of mesh frames with a single ultrasonic converter. It is possible to apply ultrasonic vibrations to up to four layers of mesh frames simultaneously. ■ By combining general-purpose vibrating sieves (electromagnetic, motor-driven, air turbine, etc.) with ultrasonic vibrations, further capacity increases can be achieved. *For more details, please contact us or download the catalog.
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basic information
Swiss Artech Ultrasonic Systems, part of the Crest Group specializing in comprehensive ultrasonic technology, has achieved significant advancements in the development of innovative ultrasonic oscillators and converters in the field of powder screening. Its novel design demonstrates effectiveness not only in powder screening but also in various areas such as transportation, supply, cleaning, and molding. (Patent pending)
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Chemicals, rubber, plastics, paper, pulp Pharmaceuticals, health foods, cosmetics Food, feed Inorganic materials, ceramics Steel, metals, mining, cement Machinery Electricity, batteries, electronics
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.