Excellent effectiveness in resolving clogging in fine powder screening environments! Nylon mesh versions are now available. Achieve up to four screens with a single oscillator!
With just a one-touch attachment to a commercially available test sieve frame, it can be used as a tabletop ultrasonic sieve shaker. We have prepared dedicated clamp band fixtures (for φ75, φ100, φ150, φ200, φ300). A new nylon mesh option will also be released. We welcome evaluations of demo units! We will provide catalog PDFs, experimental videos (YouTube), and exhibition invitation tickets. 【Features】 ■ Dramatically improves sieving capability by eliminating clogging. ■ Powder troubles! Clogging, adhesion, bridging, and agglomeration are all handled by ultrasound. ■ We have started releasing the 【Ultrasonic Scraper】 that is compatible with nylon mesh (synthetic fiber mesh). Demo units are currently being evaluated! ■ Can accommodate multi-stage setups. Up to 2 or 4 stages. ■ Can be used in conjunction with general-purpose vibrating sieves. Electromagnetic vibrators, air turbines, etc. Enhanced performance with powder dispersion effects and ultrasonic effects! *For more details, please contact us or download the catalog.
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basic information
This is an ultrasonic sieve device that can apply ultrasonic vibrations to up to four sieves with a single oscillator. It allows for simultaneous sieving of four sieves in one operation, enabling efficient experiments. Since only one oscillator is needed instead of four, it also saves on equipment costs. It can be easily attached to test sieve frames to be used as an ultrasonic sieving device. ■ Ultrasonic classification and sieving device: Prevents clogging and dramatically improves sieving capability. ■ Powder troubles! Clogging, adhesion, bridging, lifespan, and capacity issues can be resolved with ultrasound! ■ Easily attachable clamp fixtures for standard laboratory sieve frames of sizes φ75, φ100, φ150, φ200, φ300, etc., allowing ultrasonic vibrations to be transmitted to SUS mesh. ■ A new type of clamp fixture with a multi-stage design that allows vibration to be applied to a two-stage sieve frame with a single ultrasonic converter. It can apply ultrasonic vibrations to up to four sieve frames simultaneously. ■ Further capacity enhancement can be achieved by combining ultrasonic vibrations with general vibrating sieves (electromagnetic, motor-driven, air turbine, etc.).
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Applications/Examples of results
Chemicals, rubber, plastics, paper, pulp Pharmaceuticals, health foods, cosmetics Food, feed Inorganic materials, ceramics Steel, metals, mining, cement Machinery Electricity, batteries, electronics
Detailed information
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We will exhibit at the International Powder Industry Exhibition Osaka 2015! We will exhibit at the Powder Industry Exhibition Osaka 2015. Date/Location October 14 (Wednesday) - 16 (Friday), 2015, 10:00 AM - 5:00 PM Intex Osaka (Nanko) Halls 4 & 5
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.