[New Model] Approximately 1.5 times the processing capacity with the same mesh area as conventional machines! Easy to attach and detach, no tapping ball required. Three different sizes available!
A new type of ultrasonic sieve machine that maximizes the features of Artec has been released. It has about 1.5 times the processing capacity of conventional machines with the same mesh area! It is easy to attach and detach, and does not require tapping balls. Three sizes of models are available. Please inquire about test and rental machines. 【Features】 ■ The ultrasonic transducer converter is located outside the powder contact area ■ About 1.5 times the processing capacity of conventional machines with the same mesh area ■ Easy-to-attach and detach structure ■ No tapping balls required ■ Model sizes available are φ500, φ700, and φ1000 *For more details, please download the catalog or feel free to contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.