Supports operating frequency range of ultrasonic frequencies from 30kHz to 38kHz! Ultrasonic vibrations can be applied without being affected by the shape or natural frequency of the metal!
The high-performance model of the digital control DGS oscillator can apply ultrasonic vibrations with an optimal frequency range in the operating frequency band of 30kHz to 38kHz, largely unaffected by the shape and natural frequency of the connected metal. By using dedicated PC software, it is possible to set conditions such as frequency width, sweep count, and output limit. It can adapt to various screening environments (frame shapes) aimed at improving screening efficiency and reducing/preventing clogging. Additionally, a new waterproof type converter has been released, which also supports washing with water inside the isolator. 【Features】 ■ Compatible with operating frequency band of ultrasonic frequencies from 30kHz to 38kHz ■ Condition settings for frequency width, sweep count, output limit, etc. are also possible ■ Supports washing with water inside the isolator *For more details, please contact us or download the catalog.
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Detailed information
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Example of attachment to standard sieve Example of standard JIS sieve attachment: φ75 to φ300 (JIS Z 8801) Compatible with a maximum of φ600mm.
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[Experimental Example] In the treated toner powder, the application of ultrasonic vibrations allows for the passage through the sieve in a short time without agglomeration or clogging. Surface of the mesh after ultrasonic sieving.
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[Experimental Example] In the treated toner powder, the application of ultrasonic vibrations allows for the passage through the sieve in a short time without agglomeration or clogging. Surface of the mesh after sieving without ultrasound.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.