Ideal for bonding small pin ICs such as QFN.
◆Best TCO ~Small footprint, reduced changeover time~ ◆Best Quality ~Supports fast-drying paste~ ◆Wide lead frame compatibility ~Lead frame size: W102mm × L300mm~ ◆Equipped with newly developed twin dispense system ~Compatible with various pastes, stable coating performance~ ◆High precision small chip pickup ~Supports sizes from 0.15 to 8.0mm~
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basic information
It is a high-speed, high-precision die bonder for epoxy bonding for IC and LSI.
Price range
P7
Delivery Time
Applications/Examples of results
Supports small pin ICs such as QFN and other ultra-small chips.
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Company information
Since its founding in 1972, our company has upheld the management philosophy of "creativity, sincerity, and challenge." We have been committed to sincerely creating solutions for our customers' needs from their perspective, and at times, we have embraced challenges without fear of failure. With this policy, we have dedicated ourselves to the development of advanced production systems through company-wide efforts to refine our technology. As a result, we have grown into a reliable company with outstanding mechatronics technology and have contributed to the development of the industrial sector. Now, aiming to be a "company that continues to shine in the 21st century," all of our employees are challenging themselves to create and provide further advanced intellectual production systems from the customer's viewpoint and to contribute to society.