Wafer resist coating device that uses high-performance pumps for high-precision coating.
The "Automatic Wafer Resist Coating Device" is a sheet-type automatic resist coating device. The resist coating uses a high-performance pump according to viscosity, enabling high-precision application. Additionally, it can be used for applying adhesives and protective films, among other applications. The wafer transport is facilitated by a 3-axis multi-joint clean robot installed at the center of the device, with loaders and unloaders available in FOUP or cassette types. 【Features】 - Suitable for wafers from 2 inches to 18 inches and 300mm square substrates - Uses a multi-joint robot from the loader - Automatically processes through each stage to the unloader cassette For more details, please contact us or download the catalog.
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basic information
【Engineering】 ○Centering ○Loader ○HMDS ○Resist coater ○Bake ○Bake ○Bake ○Cool plate ○Unloader ●For more details, please contact us or download the catalog.
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Company information
Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.
