This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.
Set the carrier, move to the pre-set measurement position by operating the [Start] switch, and perform the measurement by operating the [Measure] switch. The θ-axis direction depends on the operator's setting. The measurement values will be displayed on the counter. It is also possible to record the data on a computer as an option.
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basic information
- The measurement position can be freely set. - Contact and non-contact types are selectable. - Please consult us regarding the measurement position, number of measurement points, carrier size, material, etc.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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