This is a device for visually inspecting the edges of φ300 mm silicon wafers (chip and chipping inspection).
Five wafers are transported from the FOSB to the inspection stage, and the wafers after inspection are returned to the same slot of the same FOSB. The wafers are handled using an edge clamp method.
Inquire About This Product
basic information
- The inspection stage rotates based on the operator's switch operation. The rotation speed and frequency can be set as desired. - We can accommodate requests for wafer size and tilt angle.
Price range
Delivery Time
Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
![[Process Analysis Instrument Technical Documentation] Online Analysis of TMAH in Developer Solution](https://image.mono.ipros.com/public/product/image/b99/2000810602/IPROS39134235426098024041.jpeg?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
