This is a device used for handling to perform P/N determination and visual inspection of silicon wafers.
The wafers are handled using a vacuum suction method. By using this device, we can improve the quality of the wafer handling work that was traditionally done by operators manually.
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basic information
- By using a twin-arm robot with a flipping function, efficient wafer transport can be achieved. - P/N determination is performed using a contact method. - The inspection stage allows for: - Wafer suction - Tilting forward and backward (maximum about 45° on one side) - 360° rotation - Swinging of the entire unit (maximum about 45° on one side) Automatic operation and manual operation via a pulse generator are also possible. - The FOSB stage has 5 stages each for the upper and lower sections, totaling 10 stages. With settings via a touch panel, the load stage can be set arbitrarily from stages 1 to 8, and the unload stage can also be set arbitrarily from stages 1 to 8.
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Applications/Examples of results
We have received orders from the semiconductor industry.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
