Are you having trouble procuring build-up substrates for the main board?
By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.
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basic information
Ball-Pitch 0.4mm Pitch BGA compatible Multilayer flex, 3 layers (double-sided flex + single-sided stacked) Minimum L/S 25μm/25μm (chip mounting layer) Total thickness below 100μm FPC processing, reel-to-reel continuous processing
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Applications/Examples of results
Semiconductor package
Company information
Canon Components has four businesses and is a "development-oriented manufacturing company" that consistently handles everything from development, design, production, and sales to patent acquisition. So far, it has developed, designed, and produced high-definition image reading components and printed circuit boards, as well as ink cartridges and heads for inkjet printers, and medical devices (such as flat panel detectors, fundus cameras, and measuring instruments), enhancing its comprehensive technological capabilities from development to production. As a member of the Canon Group, Canon Components is strongly committed to technology and has a willingness to challenge new things. By leveraging the foundational technologies and development environment within the Canon Group, it aims to continue creating key components that meet the diverse needs of customers, aspiring to further development as a sustainable and growing excellent company. To achieve this, we will tirelessly pursue transformations in "quality supremacy," "business area expansion," and "organization and human resource strengthening." The Canon Group promotes safety and health activities under the philosophy that "there is no management without safety," while also advancing activities to reduce environmental impact, aiming to contribute to the preservation of the global environment.
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