The specification is a scribing accuracy of 30 microns (30μm).
To break glass or silicon wafers, it is necessary to create scratches on the surface. This device can precisely create scratches using a super-hard wheel blade. The precision of the scratching is 30 microns (30μm).
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basic information
To break glass or silicon wafers, it is necessary to create scratches on the surface. This device can precisely create scratches with a super-hard wheel blade. The precision of the scratching (kegaki) is 30 microns (30μm). First, use the attached microscope to find the area where you want to create the cross-section. After that, use the blade attached to the linear guide to make the scratches. After scratching, break it with pliers.
Price range
P5
Delivery Time
P4
Applications/Examples of results
To break glass or silicon wafers, it is necessary to make scratches on the surface. This device can precisely make scratches with a carbide wheel blade. The precision of the scratching is 30 microns (30μm). First, you look for the area where you want to create a cross-section using the attached microscope. After that, you make the scratches with the blade attached to the linear guide. After making the scratches, you break it with pliers.
Company information
We are designing and developing scribers that precisely scratch materials such as glass and silicon wafers.
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